G01J2005/0077

Fault State Detection Apparatus

A fault state detection apparatus includes an input unit and a processing unit. The input unit receives condition monitoring data. The processing unit implements a trained machine learning algorithm to analyze the received condition monitoring data to determine if the received condition monitoring data is associated with a fault state. The trained machine learning algorithm was trained on the basis of a plurality of non-fault state condition monitoring data and associated ground truth information and on the basis of a plurality of fault state condition monitoring data and associated ground truth information. A subset of the plurality of fault state condition monitoring data was generated from one or more non-fault state condition monitoring data. Generation of fault state conditioning monitoring data in the subset of the plurality of fault state condition monitoring data comprises a transformation of non-fault state condition monitoring data to fault state condition monitoring data.

NON-CONTACT TEMPERATURE MEASUREMENT IN THERMAL IMAGING SYSTEMS AND METHODS

Systems and methods include an image capture component configured to capture infrared images of a scene, and a logic device configured to identify a target in the images, acquire temperature data associated with the target based on the images, evaluate the temperature data and determine a corresponding temperature classification, and process the identified target in accordance with the temperature classification. The logic device identifies a person and tracks the person across a subset of the images, identify a measurement location for the target in a subset of the images based on target feature points identified by a neural network, and measure a temperature of the location using corresponding values from one or more captured thermal images. The logic device is further configured calculate a core body temperature of the target using the temperature data to determine whether the target has a fever and calibrate using one or more black bodies.

Train wheel detection and thermal imaging system

A system that includes a detection device, an imaging device, and a control device is disclosed. The detection device may generate proximity data relating to a proximity of an undercarriage of a rail vehicle, and the imaging device may capture one or more thermal images of the undercarriage. The control device may receive a first thermal image and a second thermal image of the undercarriage. The first thermal image may be captured using a first integration time, and the second thermal image may be captured using a second integration time. The control device may determine composite thermal data associated with the undercarriage. The composite thermal data may include information mapping a first range of thermal data and mapping a second range of thermal data to one or more components of the undercarriage. The control device may cause an action to be performed in connection with the composite thermal data.

IMAGE CAPTURE USING RADIATION-SENSITIVE ELEMENTS HAVING A MEMORY EFFECT
20230010469 · 2023-01-12 ·

Disclosed is a method for capturing images that makes it possible to correct at least partially a memory effect of sensitive elements of a matrix used to capture the images. A corrected image is formed by subtracting, from a captured new raw image, a part of a prior raw image that was captured before the new raw image. The method is particularly suitable for sensitive elements with a first-order transfer function with respect to time, such as bolometers or microbolometers. Correction of the memory effect makes it possible to improve the transfer function and/or reduce a tail effect that is present in the images when scene elements move.

VIRTUAL THERMAL CAMERA IMAGING SYSTEM
20230007862 · 2023-01-12 ·

System and method that includes mapping temperature values from a two dimensional (2D) thermal image of a component to a three dimensional (3D) drawing model of the component to generate a 3D thermal model of the component; mapping temperature values from the 3D thermal model to a 2D virtual thermal image corresponding to a virtual thermal camera perspective; and predicting an attribute for the component by applying a prediction function to the 2D virtual thermal image.

Elastomeric Bearing Monitoring System
20230009950 · 2023-01-12 · ·

A system for monitoring of elastomeric bearings is described. A pattern or shape can be applied to a joint comprising elastomeric material. A camera can be disposed such that it can capture photographs or video of the pattern and how it deforms under torque and other stresses. Actual deformation of the shape/pattern can be compared to an expected deformation to gauge levels of degradation of the elastomeric material or other joint components.

Optical Thermography System Using a Pumped Two-dye Fluorescence Technique
20230040397 · 2023-02-09 · ·

A backside thermography technique was developed based on the temperature sensitivity of laser-induced fluorescence in flowing two-dye solutions. The approach utilizes visible light and optically transparent packaging materials to obtain spatially resolved transient thermal measurements. This technique is compatible with optically transparent water-cooled packaging, which will allow for the characterization of processes where heat is added as well as removed. A setup was designed, constructed, and used to study the performance of seven two-dye Rhodamine B (RhB)-Rhodamine 110 (Rh110) fluorescent solutions. The effect of dye concentration ratio on sensitivity, maximum frame rate, and excitation area was characterized. The system was used to demonstrate in-situ temperature measurements showing the importance of two-dye light compensation, as well as backside thermography using a simple droplet contact method to investigate temporal response. Droplet contact experiments were conducted on actively heated and cooled surfaces to study local temperature and heat flux behavior during phase change.

Far infrared sensor apparatus having multiple sensing element arrays inside single package
11573127 · 2023-02-07 · ·

A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

Ultrafast laser inscribed structures for signal concentration in focal plan arrays

The present invention relates to ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays, as well as methods of making and/or using ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays. Such ultrafast laser inscribed structures are particularly adapted to condense broad band radiation, thus allowing increased sensing efficiencies to be obtained from imaging and/or sensing apparatuses. Such ultrafast laser inscribed structures can be efficiently produced by the processes provided herein.

Systems and methods for thermal radiation detection

Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Antimonide (InSb)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.