A method may include heating a substrate in a first chamber to a platen temperature, the heating comprising heating the substrate on a platen; measuring the platen temperature in the first chamber using a contact temperature measurement; transferring the substrate to a second chamber after the heating; and measuring a voltage decay after transferring the substrate to the second chamber, using an optical pyrometer to measure pyrometer voltage as a function of time.

A system simulates hyperspectral imaging data or multispectral imaging data for a simulated sensor. Blackbody radiance of real-world thermal imagery data is computed using a Planck function, which generates a simulated spectral hypercube. Spectral emissivity data for background materials are multiplied by a per-pixel weighting function, which generates weighted spectral emissivity data. The simulated spectral hypercube is multiplied by the weighted spectral emissivity data, which generates background data in the simulated spectral hypercube. Simulated targets are inserted the background data using the Planck function. The simulated spectral hypercube is modified, and then it is used to estimate a mission measure of effectiveness of the simulated sensor.

A spatial temperature estimation system includes a thermal image acquisition unit and a space temperature estimation unit. The thermal image acquisition unit is configured to detect a temperature of at least one surface of a ceiling, a floor, or a plurality of walls of a room. The space temperature estimation unit is configured to estimate a temperature of air in an interior space of a room with reference to a CRI coefficient relating to the at least one surface and the temperature detected by the thermal image acquisition unit.

A system and method are provided for performing a test operation of a gas household cooking appliance having an oven cavity and a gas burner within the oven cavity. The system and method include an infrared thermocouple configured to be portably and temporarily positioned within the oven cavity and configured to produce an output signal in response to a change in temperature within the oven cavity to confirm that the gas burner has ignited. A control unit is configured to execute the test operation only upon receipt of the output signal from the infrared thermocouple within a predetermined amount of time following an initiation of a gas flow to the gas burner.

An infrared presence detector system includes a focal plane array and a processor coupled to the focal plane array. The array includes a first radiant energy sensor and a plurality of second radiant energy sensors, with the first and second radiant energy sensors configured to convert incident radiation into an electrical signal. The processor is coupled to the focal plane array, and is configured to control the focal plane array in a sleep mode, wherein the first radiant energy sensor is energized and the plurality of second radiant energy sensors are de-energized, and an active mode, wherein at least the plurality of second radiant energy sensors are energized when the first radiant energy sensor detects a presence.

A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven. Then, based on determining that the measured temperatures of the temperature sensitive components exceeds the temperature limits, the computer determines an elapsed time outside of the temperature limit when the measured temperatures of the temperature sensitive components exceeds the temperature limits.

A body temperature measurement method applied to a wrist wearable device includes, when a body temperature of a user is measured, measuring a first temperature at a forehead of the user using a temperature sensor, and measuring a second temperature at a wrist of the user is using a second temperature sensor at a relatively close time. Through calculation, a third temperature associated with the first temperature is displayed on a display. A fourth temperature at the wrist is then measured using the second temperature sensor. When the fourth temperature is the same as the second temperature, the third temperature is displayed on the display according to the foregoing relationship.

A system includes a first printed circuit board (PCB), a temperature sensor, a switching circuit provided on the first PCB, and a controller. The temperature sensor is configured to measure temperature of at least an area of the first PCB. The controller is configured to trigger the switching circuit to turn off power to the first PCB, based at least in part on the temperature sensor detecting a temperature above a temperature threshold. The system is able to disrupt power much faster than conventional methods of power protection which may have a blind spot to certain areas of the first PCB, since these methods rely on power disruption when a maximum power is sensed.

A thermal imaging system for a cooking appliance is capable of being calibrated for any arrangement of cooktop burners disposed on a surface of a cooking appliance. A thermal imaging system can be calibrated by processing a received thermal scan of a surface of a cooking appliance having a particular cooktop arrangement to identify a plurality of cooktop burners on the surface of the cooking appliance for the particular arrangement, determine a number of cooktop burners in the particular arrangement, and determine one or more locations of the cooktop to assign to each of the cooktop burners. Further, the determined one or more locations assigned to each of the cooktop burners can be stored in association with a respective cooktop burner. Once calibrated, the thermal imaging system can calculate a temperature for each of the cooktop burners to be used in performing subsequent control and/or safety functions.

An infrared-detecting device, includes an infrared detector configured to emit a signal representative of the thermal radiation of a hotspot, and a light source configured to emit an incident beam, preferably in a window of UV or visible wavelength. The infrared-detecting device furthermore comprises a synchronizing device connected to the light source and to the infrared detector or to the processing module, and configured to emit a synchronization signal, the infrared detector being configured to be activated in a preset time window depending on said synchronization signal.