A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.

A light detector includes a substrate, a membrane disposed on a surface of the substrate, a first and a second electrode post supporting the membrane. The first electrode post includes a first main body portion having a tubular shape spreading from a first electrode pad toward a side opposite to the substrate, and a first flange portion provided in an end portion at the side opposite to the substrate in the first main body portion. The first flange portion is provided with a first sloped surface inclined so as to approach the substrate as it goes away from the first main body portion. A first wiring layer reaches an inner surface of the first main body portion through the first sloped surface. The second electrode post and the second wiring layer are formed similarly to the first electrode post and the first wiring layer.

The invention proposed the thermal imaging radar includes of main components: Assembly pedestal, Assembly rotary shaft, and Assembly housing. Electronic circuits, encoders, mechanisms, motor are optimized arranged and scientifically designed the layout space and the weight of the structure. This device is compact for camouflage purposes, easy to assemble or disassemble, and waterproof. The invention's products can be applied in automatic security station, produces 360-degree panoramic imaging of the continuously day and night for surveillance area, detects and tracks moving objects captured by the thermal sensor. Furthermore, The product is also applicable for monitoring the ambient temperature in large areas, localizing high-temperature areas to recognize and warn the possible explosions.

Thermal monitors comprising a substrate with at least one camera position on a bottom surface thereof, a wireless communication controller and a battery. The camera has a field of view sufficient to produce an image of at least a portion of a wafer support, the image representative of the temperature within the field of view. Methods of using the thermal monitors are also described.

An electronic device may include: a display having at least one hole disposed in at least a part thereof such that light from the outside can be transmitted therethrough; a light-emitting element disposed under the display and configured to output a first infrared ray to the outside; a first light-receiving element disposed under the display at a position corresponding to the at least one hole, and configured to receive a second infrared ray transmitted from the outside; a second light-receiving element disposed under the display at a position where light from the outside is shielded; and at least one processor configured to, based on that a first sensing value according to the second infrared ray, output from the first light-receiving element, satisfies a first specified condition, while the first infrared ray is output: based on that a second sensing value output from the second light-receiving element does not satisfy a second specified condition, identify that a proximate object exists, and based on that the second sensing value satisfies the second specified condition, identify that the proximate object does not exist.

An object of the present invention is to provide a bolometer having a high TCR value and a low resistance, and a method for manufacturing the same.

According to the present invention, a bolometer manufacturing method including: fabricating an interlayer having a function that enhances binding between a substrate and a carbon nanotube, in a predetermined shape on the substrate; and, making a semiconducting carbon nanotube dispersion liquid move on the interlayer in one direction relative to the fabricated interlayer is provided.

The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

Techniques are disclosed for facilitating image relay for wearable devices with thermal imaging devices attached thereto. In one example, a system includes an attachment configured to releasably couple to an exterior surface of a wearable apparatus. The attachment includes an infrared sensor assembly configured to capture a thermal image of a scene. The attachment further includes a display component configured to provide data indicative of the thermal image. The system further includes an optical relay component configured to couple to an interior surface of the wearable apparatus. The optical relay component is further configured to receive the data from the display component and relay the data within the wearable apparatus to facilitate presenting the data for viewing by a user while wearing the wearable apparatus. Related devices and methods are also provided.

An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

A system and method for use in environment with electrical equipment is provided. The system including a housing and at least one light source located on an exterior of the housing. The light source being activated when the system is in a switching mode of operation. At least one sensor is operably coupled to the housing and configured to measure at least one parameter associated with the electrical equipment. A computing device is disposed within the housing and coupled to communicate with the at least one light source and the at least one sensor.