A method of forming an infrared detector includes defining an optical window in a cover substrate. Defining the optical window includes forming a multilayer interference filter or a periodic diffraction grating on an upper surface of the optical window and a periodic diffraction grating on the lower surface of the optical window. The method also includes performing anodic bonding of a spacer onto the cover substrate, transferring the cover substrate provided onto a base substrate, and hermetically bonding the spacer onto the base substrate.

A method for manufacturing a near-infrared sensor cover includes arranging a mask in a region of an undercoating layer formed on a rear surface of a base, the region being different from a heater formation region in which a heater is to be formed and different from a belt-shaped separation region extending along an edge of the heater formation region, forming a heat-generating film on the mask and the undercoating layer, the heat-generating film being made of the conductive heat-generating material, peeling, using a laser, the heat-generating film formed in the separation region, and removing the mask and the heat-generating film formed on the mask. The separation region has a width that is set to be smaller than a beam diameter of each of near-infrared rays transmitted from the transmitting portion.

An optical device is provided. The optical device includes a time-of-flight (TOF) sensor array, a photon conversion thin film, and a light source. The photon conversion thin film is disposed above the time-of-flight sensor array. The light source emits light with a first wavelength towards the photon conversion thin film to be converted into light with a second wavelength received by the time-of-flight sensor array. The second wavelength is longer than the first wavelength.

The present disclosure relates to a system for sensing temperature changes on a microsecond scale. The system uses a multi-channel pyrometer that works in the NIR spectrum to receive thermal radiation. Each channel includes an interference filter tuned to pass thermal radiation within a specified wavelength range, and a detector. Each detector detects thermal radiation focused on it. Each channel further includes an interference filter which reflects thermal radiation which does not pass through it to a subsequent downstream interference filter of a subsequent channel. Each subsequent interference filter is oriented to reflect the thermal radiation not passing through it to a next downstream one of the subsequent interference filters. A subsystem is included for receiving the output from the detectors and determining sensed temperature data therefrom, allowing measurement of temperatures down to 800 K.

A curved prism array applied to an infrared sensor wherein: the infrared sensor comprises at least an infrared sensing element which is used in detecting infrared signals within a solid-angled FOV and installed inside the curved prism array; the curved prism array has an incident focal plane and a plurality of emergent focal planes, both of which are not parallel with each other, such that infrared signals beyond the solid-angled FOV are received by the incident focal plane, refracted through one of the emergent focal planes and guided toward the infrared sensing element for expansion of the solid-angled FOV of the infrared sensing element.

The present disclosure relates to a system for sensing temperature changes on a microsecond scale. The system uses a multi-channel pyrometer that works in the NIR spectrum to receive thermal radiation. Each channel includes an interference filter tuned to pass thermal radiation within a specified wavelength range, and a detector. Each detector detects thermal radiation focused on it. Each channel further includes an interference filter which reflects thermal radiation which does not pass through it to a subsequent downstream interference filter of a subsequent channel. Each subsequent interference filter is oriented to reflect the thermal radiation not passing through it to a next downstream one of the subsequent interference filters. A subsystem is included for receiving the output from the detectors and determining sensed temperature data therefrom, allowing measurement of temperatures down to 800 K.

A method, which is applied for non-contact temperature measurement of a spot on a target object, includes the following steps: image a thermal image of a target area on the target object and projecting the thermal image to an image plane; select an image spot in the image plane corresponding to the spot to allow corresponding light rays to pass through, while blocking all the rest of the light rays; measure a thermal radiation strength of the corresponding to light rays; and determine a temperature from the measured thermal radiation strength according to a calibration relation. A system of performing the above method is also provided.

Methods, apparatuses and systems for imaging a battery pack is disclosed herein. An example imaging device may include an infrared sensor configured to sense reflected infrared radiation from an imaging area. The imaging device may include a prism configured to form an infrared image of a surface of the battery pack on the imaging area. A thermal map of the surface may be generated and used for determining a battery cell with a temperature that may indicate a thermal runaway. A fuse electronically coupled to the battery cell may be cut off to prevent and/or mitigate a hazardous condition for the battery.

The present description concerns an infrared imaging device (200) comprising an infrared camera (210) having an optical axis (A), said camera being intended to detect an infrared radiation in a spectral range through an element (132) transparent to said infrared radiation, the transparent element being inclined by an angle of inclination (a) greater than 0? and smaller than 90? or smaller than 0? and greater than ?90? relative to an image capture direction (C);

the device further comprising a refractor element (230) transparent to the infrared radiation in the spectral range and adapted to be positioned between the transparent element and the infrared camera, said refractor element comprising a virtual exit facet of the refractor element, corresponding to an exit facet (234) of the refractor element in a tunnel diagram of said refractor element, said virtual exit facet being substantially parallel to an entry facet (232) of the refractor element.

The present disclosure relates to systems, apparatus, and methods for monitoring plate temperature for semiconductor manufacturing. In one or more embodiments, a system for processing substrates and applicable for semiconductor manufacturing includes a chamber body including one or more sidewalls. The system includes a lid and a window, the one or more sidewalls, the window, and the lid at least partially defining an internal volume. The system includes one or more heat sources configured to heat the internal volume, a substrate support disposed in the internal volume, and a first optical sensor configured to detect energy having a first wavelength that is less than 4.0 microns. The system includes a second optical sensor configured to detect energy having a second wavelength that is less than the first wavelength.