A temperature sensor (116) comprises an electrical circuit (204) including a thermistor (206) intended to be placed next to an object (112); a temperature measurement module (222) configured for determining a measured temperature (T_M) of the thermistor (206) from a resistance of the thermistor (206); and a command module (224) configured for providing a command (C) to the electrical circuit (204) for modifying the electrical circuit (204) in a way that changes a current (IT) flowing in the thermistor (206). The temperature sensor (116) further comprises a thermal loss determination module (226) configured for determining a thermal loss (L) of the thermistor (206) from the thermistor measured temperature (T_M) and the command (C); and a temperature estimation module (228) configured for estimating a temperature (T0_E) of the object (112) from the thermistor measured temperature (T_M) and from the thermal loss (L) of the thermistor (TH).

A wearable device configured to secure to skin of a user and noninvasively measure body temperature of the user can include first and second pairs of temperature sensors configured to generate one or more signals responsive to detected thermal energy, a thermally conductive element positioned at least partially between the second pair of temperature sensors, and one or more hardware processors configured to receive the one or more signals generated by each of said first and second pairs of temperature sensors and determine one or more body temperature values of the user based on at least comparisons between different ones of the first and second pairs of temperature sensors. In some implementations, the wearable device includes thermally conductive probes for transmitting thermal energy toward ones of the first and second pairs of temperature sensors and a substrate positioned between the probes and the skin.

A device for determining the temperature of an object includes a main body with an interior space delimited by walls for receiving an object, the temperature of which is to be determined, wherein at least one determination element configured to determine the temperature is arranged or formed within at least one wall, and also at least one thermally conductive contact element which is arranged or formed on or in the wall within which the determination element is arranged or formed.

A device for determining the temperature of an object includes a main body with an interior space delimited by walls for receiving an object, the temperature of which is to be determined, wherein at least one determination element configured to determine the temperature is arranged or formed within at least one wall, and also at least one thermally conductive contact element which is arranged or formed on or in the wall within which the determination element is arranged or formed.

An object of the present invention is to provide a semiconductor apparatus capable of recognizing the actual temperature for each semiconductor chip even while driving the device.

A semiconductor apparatus of the present disclosure includes a semiconductor chip, a plurality of pad electrodes formed in the semiconductor chip, and an impedance element electrically connected between at least two pad electrodes of the plurality of pad electrodes. Then, the semiconductor apparatus is configured to be capable of measuring a temperature of the semiconductor chip by applying a certain electrical signal between the at least two pad electrodes connected with the impedance element from outside of the semiconductor chip.

A semiconductor device includes a semiconductor substrate on which a temperature sensor is formed, a plurality of insulating films formed above the semiconductor substrate, a temperature measurement wiring pattern formed on a first insulating film which is one of the plurality of the insulating films, a detection electrode which is formed on the uppermost insulating film of the plurality of the insulating films to be arranged at a position corresponding to the first temperature measurement wiring pattern and is provided for contact a temperature measurement needle, and one or more via electrodes formed in one or more insulating film between the temperature measurement electrode and the detection electrode to couple between the temperature measurement electrode and is the detection electrode.

A semiconductor device includes a semiconductor substrate on which a temperature sensor is formed, a plurality of insulating films formed above the semiconductor substrate, a temperature measurement wiring pattern formed on a first insulating film which is one of the plurality of the insulating films, a detection electrode which is formed on the uppermost insulating film of the plurality of the insulating films to be arranged at a position corresponding to the first temperature measurement wiring pattern and is provided for contact a temperature measurement needle, and one or more via electrodes formed in one or more insulating film between the temperature measurement electrode and the detection electrode to couple between the temperature measurement electrode and is the detection electrode.

An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

A motor temperature estimation system includes a first temperature time series data generation unit that generates first temperature time series data based on temperature data acquired by a temperature sensor that measures a temperature of a motor, a resistance value time series data generation unit that generates resistance value time series data based on the first temperature time series data, a second temperature time series data generation unit that generates second temperature time series data by changing parameters for estimating and calculating the temperature of the motor based on the resistance value time series data, and a parameter determination unit that determines the parameters by comparing the first temperature time series data and the second temperature time series data.