A stretchable sensor is provided. The stretchable sensor includes a first stretchable electrode including a first elastomer and a first conductor dispersed in the first elastomer, a stretchable active layer formed on the first stretchable electrode and including a third elastomer and an ion conductor dispersed in the third elastomer, and a second stretchable electrode formed on the stretchable active layer and including a second elastomer and a second conductor dispersed in the second elastomer. The stretchable sensor is effectively capable of sensing a temperature without being affected by strain and recognizing strain without being affected by temperature.

A robotic force/torque (FT) sensor restricts the conduction of heat, generated by an attached tool, through the FT sensor body to a radial direction. Heat from the tool is channeled to the center of the FT sensor body by a thermally conductive member. Additionally, heat from the tool is insulated from portions of the FT sensor body other than its center by a thermally insulating member. Transducers, such as strain gages attached to the surfaces of deformable beams, are disposed at a substantially equal distance from the center of the FT sensor body. Accordingly, as heat conducts through the FT sensor body from the center radially outwardly, all transducers experience substantially equal thermal load at any given time. Embodiments of the present invention substantially eliminate thermal gradients across groups of transducers that are wired in differential circuit topologies, such as half-bridge or quarter-bridge, enhancing the ability of such circuits to reject a common-mode signal component caused by thermal changes to the FT sensor body or the transducers themselves. Elimination of thermal gradients in the FT sensor body, other than one in the radial direction, enhances the effectiveness of known temperature compensation techniques.

A system may include a display driven using display driving circuitry to present an image via pixels. The display driving circuitry may include a sensor core compatible with one or more strain sensing circuits. The same sensor core may be used by a control system of the display to sense a stress applied to a strained region of a display using a current divider sensing circuit and/or a Wheatstone bridge sensing circuit.

The present application provides a strain sensing film, a pressure sensor, and a hybrid strain sensing system. The strain sensing film includes a semiconductor thin-film, at least two resistors are disposed on the semiconductor thin-film, one resistor has a different response to a strain with respect to at least another resistor, thereby enhancing resistance to external environmental disturbances and improving the accuracy of pressure measurements.

The disclosure relates to a load cell for a linear actuator. The load cell configured to measure a force exerted thereon by a rotary motor, and includes a spring element, a hollow portion and at least one strain gauge. The spring element includes a first side and a second side. The first side and the second side are opposite to each other. The hollow portion passes through the spring element. The at least one strain gauge is secured on the spring element and located between the first side and the second side, wherein when the force is exerted on the spring element when the rotary motor is driven to move along the first direction, the second side is moved relative to the first side, the spring element is deformed, and the at least one strain gauge changes shape, so that the force is measured and standardized under a specific range.

A sensing device for a bearing and a bearing component. The sensing device includes a sensing body for mounting into the bearing by a press fit. The sensing body is provided with: a sensing measurement module having a pressure sensor for measuring the load of the bearing and a temperature sensor for measuring the temperature of the sensing device, and the measured load is corrected using the measured temperature; a wireless communication module used for wirelessly transmitting bearing information from the sensing measurement module; and a wireless power supply module used for supplying power for the sensing measurement module and the wireless communication module. The bearing component includes a bearing and the sensing device.

Apparatus and associated methods relate to sensing a physical parameter and verifying correct operation of a system used to sense the physical parameter. A sensing device includes four resistive elements configured in a Wheatstone bridge configuration is configured to sense the physical parameter. A biasing network selectively provides first and second biasing conditions to the sensing device. First and second output electrical signals are generated by the sensing device in response to the first and second biasing conditions, respectively, selectively provided to the sensing device. The first and second output electrical signals are each indicative of the parameter value of the physical parameter, but not necessarily equal to one another. A verification module verifies correct operation of the system based on a consistency determination of first and second output electrical signals.

A pressure sensing device is provided. In the pressure sensing device, the rigid structure includes rigid blocks arranged at intervals, and strain amplification zones are formed between every two adjacent rigid blocks. The force sensors include first sensors and second sensors. The first sensors are arranged on the two installation surfaces of the strain amplification zones and capable of following the deformation of the measured object, the second sensors are arranged on the two installation surfaces of the rigid blocks and located close to corresponding first sensors. At least four force sensors are connected to form a bridge circuit, and the bridge circuit is electrically connected to a signal processing circuit, so as to detect deformation of the rigid structure and obtain a force acted on the measured object. An output signal of each of the second sensors serves as a temperature compensation signal of the corresponding first sensors.

An integrated circuit is described herein that includes a semiconductor substrate. First and second piezoresistive sensors are on or in the substrate where each have a respective sensing axis extending in first and second directions respectively parallel with a surface of the substrate, where the second direction is perpendicular to the first direction. A third piezoresistive sensor is on or in the substrate and has a respective sensing axis extending in a third direction parallel with the surface of the substrate and neither parallel nor perpendicular to the first and second directions.

A method for fabricating a strain sensing film, a strain sensing film, and a pressure sensor are provided in the present application. A semiconductor wafer is firstly thinned to form a semiconductor film. A die attach film is attached onto the semiconductor film. A resulting semiconductor film is diced to form a plurality of independent strain films. The plurality of independent strain films are transferred to a substrate, and the plurality of independent strain films are completely attached to the substrate. A metal pad of each of the plurality of independent strain films is electrically connected with a corresponding metal pad of the substrate. The plurality of independent strain films are packaged. In this way, the package process of the strain sensing film is completed, which tackles the problem that the existing COB packaging has defects when being applied to package the sensor film.