A sensor module and a joint are made of different metal materials. The sensor module includes a first portion located near a diaphragm and a second portion having a large-diameter portion whose diameter is larger than that of the first portion. A step engaged with a peripheral edge of the large-diameter portion is formed on the joint. The large-diameter portion and the joint are mutually bonded through a bonding portion. The bonding portion is bonded by a plastic deformation bonding that is so-called metal flow. A space is defined between the joint and the module body.

A pressure sensor includes a sensor element, an inner frame configured to receive at least a portion of the sensor element, and a housing configured to receive the inner frame therein. The inner frame is formed of a metal material and includes a printed circuit board assembly to be electrically connected to the sensor element. The housing is formed of a resin material.

Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.

Certain embodiments of the disclosed technology provide systems and methods for an improved header and corresponding port associated with a transducer assembly. The header and port define mating threaded portions, thread stop portions, and a weld gap region. The thread stop portions are configured to mate and maintain a pre-loading tension between the threaded portions during and after applying a weld in the weld gap region. The weld gap region is configured to have a predetermined gap distance such that the weld seals the transducer without stress in the weld. The mating of the first and second thread stops are configured to maintain at least a portion of the pre-loading tension.

An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.

A pressure sensor has a housing, an air lead-in hole, a pressure lead-in hole, an inner cavity, a sensor chip, a lead frame and a cover plate. One end of the air lead-in hole is in communication with the inner cavity of the housing, and the other end of the air lead-in hole is in communication with the air; the pressure lead-in hole is perpendicularly disposed at the center of the upper surface of the housing, two steps are disposed on the upper surface of the inner cavity, and a horizontal surface-mounted device surface is disposed on each of the steps. The center of the sensor chip is aligned with the centers of the pressure lead-in hole, and the lower end of the pressure lead-in holes are in communication with the cavity of the sensor chip.

A pressure sensor assembly includes a pressure sensor, a pedestal and an electrically conductive header having a header cavity. The pressure sensor includes, an electrically conductive sensing layer having a sensor diaphragm, an electrically conductive backing layer having a bottom surface that is bonded to the sensing layer, an electrically insulative layer having a bottom surface that is bonded to a top surface of the backing layer, and a sensor element having an electrical parameter that changes based on a deflection of the sensor diaphragm in response to a pressure difference. The pedestal is bonded to the electrically insulative layer and attached to the header within the header cavity.

A pressure sensor and a packaging method thereof. The pressure sensor comprises: a sensitive chip, which comprises a thin-wall part and a supporting part connected to the periphery of the thin-wall part, the supporting part being provided with an electrode; a sealing element, which is fitted over the sensitive chip and partially surrounds together with the sensitive chip to form a sealing cavity, the sealing element being provided with a through hole corresponding to the electrode; a conductive component, which is provided in the through hole in a sealed mode and electrically connected to the electrode, the conductive component and the sealing element being arranged in an insulating mode, and the conductive component comprising a filling part and a leading-out part embedded in the filling part.

A pressure sensor configured to prevent tearing or cracking of an insulating film for insulating between a stem and a detection circuit from occurring. A stem having a planar outer bottom surface, an outer side surface intersecting the outer bottom surface, and a pressure receiving inner surface that is the opposite surface to the outer bottom surface and receives pressure from a fluid to be measured; and a detection circuit provided to the outer bottom surface with an insulating film interposed therebetween. The stem has a foot part that: is formed to surround the outer bottom surface; consists of a surface which, when observed parallel to the outer bottom surface, faces a direction different from the direction of the outer bottom surface and the outer side surface; and connects between the outer bottom surface and the outer side surface. The insulating film covers a portion of the foot part.

In an embodiment a pressure sensor device includes a substrate body, a pressure sensor having a membrane and a cap body having at least one opening, wherein the pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to a main plane of extension of the substrate body, and wherein the mass of the substrate body amounts to at least 80% of the mass of the cap body and at most 120% of the mass of the cap body.