A pressure sensor includes a cylindrical case defining an inner space in communication with an outer space; a pressure detector provided in the inner space and configured to detect a gauge pressure of a target fluid; an atmospheric pressure detector configured to detect an atmospheric pressure; and an electronic component configured to calculate an absolute pressure of the target fluid on a basis of the gauge pressure and the atmospheric pressure. The absolute pressure is obtained without requiring airtightness of the case between the inner space and the outer space, and thus, there is no requirement for a seal member to be included between the inner space and the outer space.

A pressure sensor chip includes a base, a first layer including a first cavity and joined to an upper surface of the base, a second layer joined to an upper surface of the first layer, a third layer including a second cavity and joined to an upper surface of the second layer, and a fourth layer including a third cavity and joined to an upper surface of the third layer. The second layer includes a first diaphragm between the first and second cavities. The fourth layer includes a second diaphragm between the second cavity and a space in communication with outside. A top end of the third cavity is in communication with outside. The bottom end of the third cavity is in communication with the second cavity. The first cavity is sealed. The pressure in the first cavity is lower than the pressure in the second cavity.

According to one embodiment, a pressure detection device includes a buffer layer formed of an elastic material and including a press surface including a biaxially curved surface and an installation surface including a uniaxially curved surface opposing the press surface with an interval therebetween, and a sheet-shape pressure sensor provided in tight contact with the installation surface and uniaxially curved along the installation surface.

A sensor module, including a main body shell and a sensing device provided in the main body shell; the sensing device includes a sensor, an upper cover plate, a lower cover plate and a circuit plate; the sensor is mounted on the circuit plate; the upper cover plate and the lower cover plate are respectively mounted on the upper and lower sides of the circuit plate, and are configured to support the main body shell and fix the circuit plate; an accommodation cavity for storing an insulating fluid is provided between the upper cover plate and the circuit plate, between the upper cover plate and the sensor, and between the lower cover plate and the circuit plate; and a first acoustic window is provided at a portion of the upper cover plate located above the sensor. Further disclosed are a sensor assembly and an acoustic logging tool.

A door assembly includes a structural wrapper defining an insulating cavity. The structural wrapper defines a sensor port. A sensor assembly is coupled to an outer surface of the structural wrapper proximate to the sensor port. The sensor assembly includes a connector having a base coupled to a housing. The base is coupled to the structural wrapper. The connector defines an interior in fluid communication with the insulating cavity. A pressure sensor is disposed within the housing. The pressure sensor is configured to sense a pressure within the insulating cavity. At least one plate is disposed at an open end of the housing. The pressure sensor includes sensor pins that extend through the at least one plate.

A surface mounting device has one body of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals. The base region has a Young's modulus lower than 5 MPa. For forming the device, the body is attached to a supporting frame including contact terminals and a die pad, separated by cavities; bonding wires are soldered to the body and to the contact terminals; an elastic material is molded so as to surround at least in part lateral sides of the body, fill the cavities of the supporting frame and cover the ends of the bonding wires on the contact terminals; and a cap is fixed to the base region. The die pad is then etched away.

Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

A pressure sensor includes: a base substrate including an embossed pattern; a first conductive layer disposed on the base substrate; a pressure sensitive material layer disposed on the first conductive layer such that its electrical characteristic is varied corresponding to a strain applied thereto, the pressure sensitive material layer including a dielectric and nanoparticles dispersed in the dielectric; and a second conductive layer disposed on the pressure sensitive material layer, wherein the dielectric and the nanoparticle include materials having pyroelectricities of polarities opposite to each other.

The invention relates to a device for measuring an operating variable, to be fitted onto a tyre, comprising: an electronic circuit distributed over a first face of an electronic board and comprising a sensor; a protective housing at least partially covering the electronic circuit; and at least one first antenna wire having one end galvanically connected to the electronic circuit and integrally extending so as to project laterally from the housing;

According to the invention, the housing comprises a lateral portion which projects substantially tangentially to a proximal end portion of the first wire in accordance with the generatrix of said first wire.