A method for predicting the electrical functionality of a semiconductor package, the method includes performing a first stiffness test for a first semiconductor package, receiving failure data for the first semiconductor package, the failure data includes results of an electrical test performed after the first semiconductor package is assembled on a printed circuit board, generating a database comprising results of the first stiffness test as a function of the failure data for the first semiconductor package, performing a second stiffness test for a second semiconductor package, identifying a unique result from the results of the first stiffness test in the database, the unique result aligns with a result of the second stiffness test, and predicting a failure data for the second semiconductor package based on the failure data for the first semiconductor package which corresponds to the unique result of the first stiffness test identified in the database.

Aspects of the technology relate to an apparatus and method for testing a material for use in a lighter-than-air craft deployable in the stratosphere. The apparatus and method may include and use a base plate and at least one ring component to attach to the base plate to secure a portion of the material. The at least one ring component has an elliptical shape including a minor radius having a first predetermined length and a major radius having a second predetermined length. The base plate receives a gas to inflate and pressurize the portion of the material. The first predetermined length and second predetermined length are selected to impart a stress ratio up to a predetermined maximum ratio onto the portion of the material through a predetermined temperature range when the portion of the material is inflated to a predetermined pressure.

A test apparatus includes a first grip, a second grip movable relative to the first grip, a test specimen disposed to provide a load path between the first grip and the second grip, and a test chamber disposed to both substantially envelope the test specimen and move with one of the first grip and the second grip. The test chamber does not contact the test specimen. Another test apparatus includes, a first grip, a second grip movable relative to the first grip, a test specimen disposed to provide a load path between the first grip and the second grip, a first test chamber disposed to both substantially envelope the test specimen and move with one of the first grip and the second grip, and a second test chamber disposed to both substantially envelope both the test specimen and the first test chamber.

The present disclosure discloses a temperature-controllable large-size geotechnique true triaxial multi-field coupling test system and a test method. The system includes a host loading mechanism, a deformable large-size soil box, an independent three-dimensional loading unit, a refrigeration, water and salt supplementation unit, and a soil-water-ice-salt change monitoring unit. The deformable large-size soil box is arranged on the host loading mechanism. In combination with the special structural design, monitoring is carried out by dividing a large-size soil test sample into environmental soil and a core soil region to eliminate the size effect of the test. The solution can simulate a three-dimensional stress state of the soil test sample in a three-dimensional open system. In consideration of the evolution of hydrothermal salt and three-dimensional migration of temperature, water, salt, etc. between the soil and the environment, temperature-water-salt-stress-strain multi-field coupling is realized.

The present disclosure discloses a temperature-controllable large-size geotechnique true triaxial multi-field coupling test system and a test method. The system includes a host loading mechanism, a deformable large-size soil box, an independent three-dimensional loading unit, a refrigeration, water and salt supplementation unit, and a soil-water-ice-salt change monitoring unit. The deformable large-size soil box is arranged on the host loading mechanism. In combination with the special structural design, monitoring is carried out by dividing a large-size soil test sample into environmental soil and a core soil region to eliminate the size effect of the test. The solution can simulate a three-dimensional stress state of the soil test sample in a three-dimensional open system. In consideration of the evolution of hydrothermal salt and three-dimensional migration of temperature, water, salt, etc. between the soil and the environment, temperature-water-salt-stress-strain multi-field coupling is realized.

An integral tension test system for a large-tonnage basalt fiber anchor cable includes: a plurality of basalt fiber anchoring bars each comprising a basalt fiber reinforced plastic (BFRP) bundle, a steel strand, a first and a second steel casing pipes, the BFRP bundle including a plurality of BFRPs, and a grating array temperature, stress and vibration sensing optical cables bonded in the BFRP; a vibration table and a reaction frame arranged thereon, wherein the first steel casing pipe of the basalt fiber anchoring bar is located in the reaction frame, the steel strand penetrates one end of the reaction frame to be connected to a center hole jack, and the second steel casing pipe of each basalt fiber anchor cable is located outside the reaction frame to be anchored; and a data acquisition module connected to all of the grating array temperature, stress and vibration sensing optical cables.

An apparatus for testing paving samples includes a base that includes a paving sample tray about the cabinet and configured for translation relative to the cabinet. A roller is configured for imparting compressive forces to a sample carried by the sample tray. An arm is configured for moving the roller from a stowed position to an in-use position where the roller contacts the sample. A cylinder assembly having a piston therein supplies pressure forces to the arm to move the arm from the stowed position to the in-use position, wherein a depth of travel of the arm is limited by the sample. As the sample is compressed, the depth of travel increases. A measurement device is in communication with the cylinder for determining an amount of travel of the arm to thus determine an amount of compression of the sample.

A high-throughput and small size samples tension, compression, bending test system is disclosed. The system includes a computer unit, a motor and a number of the sample testing modules mounted horizontally or perpendicular to that ground on a workbench. The sample testing modules include a sample testing modules base plate fixedly attached to the workbench, and a ball screw, a displacement sensor, a moving beam, a clamp unit, a linear moving platform unit and a force value sensor arranged on the sample testing modules base plate. A number of the sample testing modules are arrange in parallel on the workbench or uniformly distributed in a circumferential direction with a point on the workbench as a circular center.

Methods, devices, and systems for testing the flexibility of a sample such as an electronic device are provided herein. A testing system can have a motor operably connected to a mandrel such that the motor causes the mandrel to accurately and precisely rotate and cause the sample to conform to an outer surface of the mandrel. Moreover, a proximal end of the sample is secured to the outer surface of the mandrel, and the opposing distal end is controlled by a retractable holder such that the entire sample is subjected to a constant bend radius as the mandrel rotates. Other aspects and features such as controlling the environment around the mandrel and securing small samples to the mandrel are also described herein.

A test fixture for securing a test article is disclosed. The test fixture includes a frame, an upper grip, at least one heat shield, a cooling assembly, and insulation. The frame defines an upper portion and a lower portion. The lower portion of the frame is releasably mounted to a vibration device. The upper grip is connected to the upper portion of the frame and the lower grip is connected to the lower portion of the frame. The heat shield is positioned to insulate at least one of the upper grip and the lower grip. The upper grip is configured to secure an upper portion of the test article along an upper interface. The lower grip is configured to secure a lower portion of the test article along a lower interface. The cooling assembly transports a cooling medium across at least one of the upper interface and the lower interface.