A hybrid radiation imaging sensor includes a low x-ray attenuating substrate, a photoconductor disposed over the substrate, and a scintillator disposed over the photoconductor. By combining direct x-ray conversion to electron-hole pairs in the photo-conductor with indirect conversion of x-rays downstream of the photoconductor within the scintillator, improved x-ray imaging can be attained through an electronic readout located upstream of both the photoconductor and the scintillator without the need for excessive x-ray dosing.

The present invention relates to a radiation detector (100) comprising: i) a substrate (110); ii) a sensor, which is coupled to the substrate, the sensor comprising a first array (120) of sensor pixels, a second array (130) of signal read-out elements, and an electronic circuitry which is configured to provide image data based on signals received from the signal read-out elements; iii) a transducer, which is coupled to the substrate and to the sensor, the transducer comprising a third array (140) of subpixels, wherein at least two subpixels are assigned to one sensor pixel; wherein the second array of signal read-out elements and the third array of subpixels correspond to each other; wherein each of the subpixels comprises a radiation conversion material.

The present invention relates to an X-ray detector (10) comprising two or more scintillator layers, comprising: a first scintillator layer (20); a second scintillator layer (30); a first photodiode array (40); a second photodiode array (50); and at least one light emitting layer (60). The first scintillator layer is configured to absorb X-rays from an X-ray pulse and emit light. The first photodiode array is positioned adjacent to the first scintillators layer. The first photodiode array is configured to detect at least some of the light emitted by the first scintillator layer. The second scintillator layer is configured to absorb X-rays from the X-ray pulse and emit light. The second photodiode array is positioned adjacent to the second scintillator layer. The second photodiode array is configured to detect at least some of the light emitted by the second scintillator layer. The at least one light emitting layer is 10 configured to emit radiation such that at least some of the emitted radiation irradiates the first photodiode array and at least some of the emitted radiation irradiates the second photodiode array.

A radiation imager comprising pixels each including a converter to generate a signal, a sampling circuit and a processor is provided. The sampling circuit samples the signal with first sensitivity and with second sensitivity higher than the first sensitivity. If a first signal value obtained by sampling the signal with the first sensitivity is smaller than a first threshold, the processor generates a pixel value based on a second signal value obtained by sampling the signal with the second sensitivity, if the first signal value exceeds a second threshold larger than the first threshold value, the processor generates a pixel value based on the first signal value, and if the first signal value is not less than the first threshold and not more than the second threshold, the processor generates a pixel value based on the first and second signal values.

A plurality of control lines extending in a first direction, a plurality of data lines that extend in a second direction crossing the first direction, a photoelectric converter that includes a photoelectric conversion element and is electrically connected to a corresponding control line and a corresponding data line, a scintillator provided on a plurality of the photoelectric converters, a bias line electrically connected to a plurality of the photoelectric conversion elements, a voltage generation circuit electrically connected to the bias line, and a radiation incidence determination circuit that is electrically connected to the bias line and detects a change of a voltage occurring at an incidence start of radiation are included.

A radiation detector having a plurality of pixels is provided. A respective one of the plurality of pixels includes a base substrate; a thin film transistor on the base substrate; an insulating layer on a side of the thin film transistor away from the base substrate; a photosensor on a side of the insulating layer away from the base substrate; a passivation layer on a side of the photosensor away from the base substrate; a scintillation layer on a side of the passivation layer away from the base substrate; and a reflective layer on a side of the scintillation layer away from the base substrate. The photosensor includes a first polarity layer in direct contact with the passivation layer. All sides of the first polarity layer other than a side internal to the photosensor are entirely in direct contact with the passivation layer.

An imaging region including a plurality of detection elements each including a conversion element configured to convert radiation into an electric signal, a first signal line, and a signal processing circuit configured to process a signal output via the first signal line, wherein the plurality of detection elements include a first detection element and a second detection element which are connected to the first signal line, a sensitivity of the first detection element to radiation is set to be different from a sensitivity of the second detection element to radiation, and the signal processing circuit generates information related to irradiation of radiation to the imaging region based on signals from the first detection element and the second detection element which are connected to the first signal line.

An imager includes: an array of imager elements configured to generate image signals based on radiation received by the imager; and circuit configured to perform readout of image signals, wherein the circuit is configured to be radiation hard. An imager includes: an array of imager elements configured to generate image signals based on the radiation received by the imager; and readout and control circuit coupled to the array of imager elements, wherein the readout and control circuit is configured to perform signal readout in synchronization with an operation of a treatment beam source.

An imager includes: an array of imager elements configured to generate image signals based on radiation received by the imager; and circuit configured to perform readout of image signals, wherein the circuit is configured to be radiation hard. An imager includes: an array of imager elements configured to generate image signals based on the radiation received by the imager; and readout and control circuit coupled to the array of imager elements, wherein the readout and control circuit is configured to perform signal readout in synchronization with an operation of a treatment beam source.

A dynamic X-ray detecting panel, an X-ray detector including the same, and a method of driving an X-ray detector are disclosed. The method of driving the X-ray detector is a method of driving a dynamic X-ray detector including the X-ray detecting panel. The X-ray detecting panel includes multiple pixels arranged in a matrix, each of the pixels includes a readout thin film transistor, a reset thin film transistor, and a photodiode, and line reset, window time, and readout proceed with respect to the multiple pixels in each row.