A method is for generating an X-ray image dataset via an X-ray detector having a converter element and a multiplicity of pixel elements. In an embodiment, the method includes first counting of at least one quantity of count signals dependent upon the incident X-ray radiation in each pixel element of the multiplicity of pixel elements; second counting of at least one quantity of coincidence count signals in each pixel element of the subset of pixel elements with at least one further pixel element of the multiplicity of pixel elements; and generating an X-ray image dataset based upon the at least one quantity of count signals counted in each pixel element of the multiplicity of pixel elements and upon the at least one quantity of coincidence count signals counted in each pixel element of the subset of pixel elements.

An apparatus suitable for detecting X-ray is disclosed. In one example, the apparatus comprises an X-ray absorption layer and a controller. The X-ray absorption layer comprises a first pixel and a second pixel. The controller is configured for determining whether all carriers generated in the X-ray absorption layer by an X-ray photon are collected by the first pixel and the second pixel, and determining the energy of the X-ray photon based on a sum of a first portion of the carriers that is collected by the first pixel and a second portion of the carriers that is collected by the second pixel.

A data processing apparatus according to an embodiment includes acquisition circuitry and specification circuitry. The acquisition circuitry is configured to acquire a detector signal containing a first component that is based on Cherenkov light and a second component that is based on scintillation light. The specification circuitry is configured to specify timing information about generation of the detector signal by curve fitting to the first component.

A detector system which can be switched between single photon counting and charge integrating mode depending on the application, the photon flux and energy. Although the space for electronics in a pixel or strip detector system is very limited (as each channel is limited by the pixel size), the reconfiguration of the analog chain and the logic/counter in this smart way yields to have a detector system allowing both modes of operation and, therefore, effectively combining the characteristics of an Eiger® single photon counting system and a Jungfrau® charge integrating pixel detector system into one single detector. Depending on the application, the flux and the photon energy, the operator is enabled to switch between single photon counting and charge integrating mode of operation.

A detector may be provided with an array of sensing elements. The detector may include a semiconductor substrate including the array, and a circuit configured to count a number of charged particles incident on the detector. The circuit of the detector may be configured to process outputs from the plurality of sensing elements and increment a counter in response to a charged particle arrival event on a sensing element of the array. Various counting modes may be used. Counting may be based on energy ranges. Numbers of charged particles may be counted at a certain energy range and an overflow flag may be set when overflow is encountered in a sensing element. The circuit may be configured to determine a time stamp of respective charged particle arrival events occurring at each sensing element. Size of the sensing element may be determined based on criteria for enabling charged particle counting.

A radiation imager comprising pixels each including a converter to generate a signal, a sampling circuit and a processor is provided. The sampling circuit samples the signal with first sensitivity and with second sensitivity higher than the first sensitivity. If a first signal value obtained by sampling the signal with the first sensitivity is smaller than a first threshold, the processor generates a pixel value based on a second signal value obtained by sampling the signal with the second sensitivity, if the first signal value exceeds a second threshold larger than the first threshold value, the processor generates a pixel value based on the first signal value, and if the first signal value is not less than the first threshold and not more than the second threshold, the processor generates a pixel value based on the first and second signal values.

A radiographic apparatus includes a plurality of pixel groups, bias sources, and a sensing unit, wherein each pixel group includes a pixel including a conversion element for converting radiation into a charge. Each bias source supplies a bias potential to the conversion element of a pixel via a bias line. The sensing unit samples a first signal value indicating a current flowing through a first bias line connected to a first pixel group including a pixel of which a switch element is turned on and a second signal value indicating a current flowing through a second bias line connected to a second pixel group where the switch element is off at timings overlapping at least in part and determines presence or absence of radiation irradiation based on the first signal value and the second signal value. The first and second bias lines have substantially same time constants.

One embodiment is circuitry for implementing a baseline restoration (“BLR”) circuit for a photon-counting computed tomography (“PCCT”) signal chain, the circuitry comprising a multi-level discriminator circuit for receiving a shaper voltage from the PCCT signal chain, the discriminator circuit outputting a digital signal indicative of one of a range of voltages within which the shaper voltage falls; a digital-to-analog converter (“DAC”) connected to receive the digital signal output from the discriminator circuit, the DAC converting the received digital signal to a corresponding active reference voltage; and a feedback circuit that injects a cancellation current proportional to the difference between the shaper voltage and the active reference voltage at the input of the PCCT signal chain.

A sensor system includes a detector substrate, multiple readout substrates and a processing substrate. The detector substrate has a detector mounted thereon. Each of the readout substrates is disposed perpendicular to the detector substrate, and has corresponding readout circuitry mounted thereon. The processing substrate is disposed perpendicular to each of the readout substrates and parallel to the detector substrate, and has one or more processing elements mounted thereon. Electrical connections between component nodes on the detector substrate and corresponding readout substrates are made using connectors or right-angled solder joints created using a solder reflow process. Electrical connections between component nodes on the processing substrate and corresponding readout substrates are also made using connectors or right-angled solder joints created using a solder reflow process. The geometric arrangement of the substrates allows for high density of pixelation on the detector. In an embodiment, the sensor system is a radiation detector system.

In described examples, a charge sensitive amplifier (CSA) generates an integrated signal in response to a current signal. A high pass filter is coupled to the CSA and receives the integrated signal and an inverse of an event signal, the high pass filter generates a coarse signal. An active comparator is coupled to the high pass filter and receives the coarse signal and a primary reference voltage signal, the active comparator generates the event signal.