An apparatus for monitoring strain in an optical chip in silicon photonics platform. The apparatus includes a silicon photonics substrate shared with the optical chip. Additionally, the apparatus includes an optical input configured in the silicon photonics substrate to supply an input signal of a single wavelength. The apparatus further includes a first waveguide arm and a second waveguide arm embedded in the silicon photonics substrate to form an on-chip interferometer. The second waveguide arm forms a delay line being disposed at a region in or adjacent to the optical chip. The on-chip interferometer is configured to generate an interference pattern serving as an indicator of strain distributed at the region in or adjacent to the optical chip. The interference pattern is caused by a temperature-independent phase shift at the single wavelength of the interferometer between the first waveguide arm and the second waveguide arm.

A balanced homodyne detection optical circuit according to the present disclosure is a planar optical waveguide circuit in which a circuit made of an optical waveguide including a dielectric or a semiconductor is formed on a substrate, the balanced homodyne detection optical circuit including an input port of local oscillator light and an input port of measurement light (squeezed light (including excitation light)), wherein a wavelength demultiplexing circuit which demultiplexes only the measurement light is arranged immediately after the input port of measurement light, a 50% multiplexing/demultiplexing circuit is arranged which causes squeezed light having been demultiplexed by the wavelength demultiplexing circuit and the local oscillator light to respectively branch at a branching ratio of 50% and to interfere with each other, and two output ports are arranged to which two outputs from the 50% multiplexing/demultiplexing circuit are guided.

An optical beam combiner circuit includes a plurality of branch portions configured to divide optical beams output from a plurality of input waveguides, a combiner unit configured to combine optical beams, each of the optical beams being one of the divided optical beams obtained by one of the plurality of branch portions, an output waveguide configured to output an optical beam obtained by the combiner unit combining the optical beams, a plurality of monitoring waveguides configured to output optical beams, each of the optical beams being another of the divided optical beams obtained by one of the plurality of branch portions, and a plurality of light-blocking grooves provided on both sides with respect to each input waveguide, the plurality of light-blocking grooves being positioned to enable stray light not coupled to the plurality of input waveguides to be reflected toward an end surface different from an exit end surface of each monitoring waveguide and also different from an exit end surface of the output waveguide.

A structure for a photonic integrated circuit, comprising: a substrate; a first portion of n-type semiconductor material on a first surface area of the substrate, a second portion of n-type semiconductor material on a second surface area of the substrate; a waveguide; and an element between the first portion and the second portion. The waveguide is on and in contact with the element. The element is configured to reduce electric current flow from the first portion to the second portion during propagation of light via the waveguide.

An optical switch is configured by providing a planar lightwave circuit layer on a top surface of a Si substrate. The circuit layer forms, on the top surface of the substrate, an optical waveguide including an underclad layer, an optical waveguide core, and an overclad layer. The optical waveguide is provided to have a structure configuring a Mach-Zehnder interferometer. A heater is provided at a position just above an arm of the core on the top surface of the clad layer, and power supply electric wires are electrically connected to both ends of the heater. In a local portion including an interface between the clad layer and the top surface of the substrate, trench structure portions as concave grooves are provided.

An optical phased array (OPA) photonic integrated chip includes a plurality of array elements, a plurality of phase shifters, a plurality of combiners, and an edge coupler configured to couple to a single mode waveguide. The plurality of phase shifters includes a layer of phase shifters that has a phase shifter connected to each array element in the plurality of array elements. The plurality of combiners is configured to connect the plurality of phase shifters to the edge coupler. The plurality of combiners includes a first combiner that has a first output that is connected to a second combiner or the edge coupler, and a second output of the first combiner is connected to a photodetector. An in-phase light portion at the first combiner is output through the first output, and an out-of-phase light portion at the first combiner is output through the second output.

Disclosed herein is a recirculating programmable photonic circuit including a programmable optical coupler including two first programmable waveguides and configured to adjust optical coupling efficiency of an optical signal based on a vertical movement of one of the two first programmable waveguides, a phase shifter including a second programmable waveguide and configured to change a phase of the optical signal based on a horizontal movement of the second programmable waveguide with respect to the first programmable waveguides, a plurality of core cells connected to each of the programmable optical coupler and the phase shifter to form a predetermined shape, the core cells being selectively driven by moving the optical signal from the predetermined shape according to the optical coupling efficiency and the phase, and an actuator electrically connected to one side of each of the plurality of core cells and configured to control the vertical movement and the horizontal movement.

An on-chip interferometer and a spectrometer including the interferometer are provided. An on-chip interferometer includes a waveguide for propagation of an optical signal including an input waveguide; at least two interferometer arms having one or more slot waveguides; and an output waveguide; wherein the input waveguide is split into the at least two interferometer arms which are recombined into the output waveguide; and a control mechanism configured for controlling a relative time delay between optical signals propagating in the two interferometer arms by modifying one or more slot widths of one or more of the slot waveguides; and wherein the relative time delay is at least 1, 2, 5, or at least 10 fs or at least one optical period of the longest optical wavelength of the optical signal.

An optical aperture system is provided that includes a photonic integrated circuit. The photonic integrated circuit includes a plurality of apertures, a plurality of optical phase shifters coupled to respective apertures of the plurality of apertures, an optical splitter-combiner coupled to the plurality of optical phase shifters, an optical switch coupled to the optical splitter-combiner, a light source coupled to the optical switch, and a photodetector coupled to the optical switch. The optical aperture system further includes a controller configured to execute a first set of instructions to control the plurality of optical phase shifters and the light source in accordance with a first operating mode of a plurality of operating modes of the optical aperture system, and a processor configured to execute a second set of instructions to process an output of the photodetector in accordance with the first operating mode of the optical aperture system.

Embodiments herein relate to a photonic integrated circuit (PIC). The PIC may include a transmit module and a receive module. An optical port of the PIC may be coupled to the transmit module or the receive module. A semiconductor optical amplifier (SOA) may be positioned in a signal pathway between the optical port and the transmit module or the receive module. Other embodiments may be described and/or claimed.