A method of fabricating three-dimensional (3D) structures comprises forming a patterned area in a handle wafer, and bonding a mold wafer over the patterned area to produce one or more sealed cavities having a first pressure in the handle wafer. The mold wafer is heated past its softening point at a second pressure different from the first pressure to create a differential pressure across the mold wafer over the sealed cavities. The mold wafer is then cooled to harden the mold wafer into one or more 3D shapes over the sealed cavities. One or more materials are deposited on an outer surface of the mold wafer over the 3D shapes to form a structure layer having 3D structures that conform to the hardened 3D shapes of the mold wafer. The 3D structures are then bonded to a device wafer, and the handle wafer is removed to expose the 3D structures.

An optical element includes a three-dimensional structure having a curved surface; and a retardation plate bent along the curved surface. The retardation plate includes a transparent substrate and a liquid crystal layer formed over the transparent substrate. The retardation plate has a slow axis and a fast axis. A glass-transition temperature, Tgne, in a slow axis direction of the retardation plate is higher than a glass-transition temperature, Tgno, in a fast axis direction of the retardation plate.

A non-photosensitive resin composition including: a self-cross-linkable copolymer having structural units of Formulae (1) and (2): ##STR00001##
wherein each R.sup.0 is independently a hydrogen atom or methyl group; X is an —O— group or an —NH— group; R.sup.1 is a single bond or a C.sub.1-6 alkylene group; R.sup.2 is a C.sub.1-6 alkyl group; a is an integer of 1 to 5, b is an integer of 0 to 4, and when a and b satisfy 1≦a+b≦5, and b is 2, 3, or 4, such R.sup.2 optionally differ from each other; R.sup.3 is a divalent organic group of Formula (I), Formula (II), or Formula (III), and R.sup.4 is an organic group having an epoxy group: ##STR00002##
wherein c is an integer of 0 to 3, d is an integer of 1 to 3, and each e is independently an integer of 2 to 6; and a solvent.

Provided are a lens structure capable of increasing a light absorbance and reducing optical crosstalk by manufacturing a multilayered aperture having a form of a metal layer-dielectric layer-metal layer stacked in a vertical direction and pore patterns formed on both metal layers as an aperture of a microlens array, and a manufacturing method thereof.

Embodiments comprise a system created through fabricating a lens array through which lasers are emitted. The lens array may be fabricated in the semiconductor substrate used for fabricating the lasers or may be a separate substrate of other transparent material that would be aligned to the lasers. In some embodiments, more lenses may be produced than will eventually be used by the lasers. The inner portion of the substrate may be formed with the lenses that will be used for emitting lasers, and the outer portion of the substrate may be formed with lenses that will not be used for emitting lasers—rather, through etching these additional lenses, the inner lenses may be created with a higher quality.

A microlens array substrate includes a substrate. A plurality of first recesses are provided in a first area of a surface of the substrate. A plurality of second recesses are provided in a second area of the surface of the substrate. The second area is outside of the first area. A light transmission layer has a refractive index which is different from a refractive index of the substrate and is provided to cover the surface of the substrate and to bury the first recesses and the second recesses. Each of the first recesses has a first depth from a surface of the light transmission layer. Each of the second recesses has a second depth from the surface of the light transmission layer. The second depth is deeper than the first depth.

Various embodiments include a display panel with integrated micro lens array. The display panel typically includes an array of pixel light sources (e.g., LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The array of micro lenses are aligned to the pixel light sources and positioned to reduce the divergence of light produced by the pixel light sources. The display panel may also include an integrated optical spacer to maintain the positioning between the micro lenses and pixel driver circuits.

Image quality of an imaging element having a configuration in which pixels having color filters are arranged two-dimensionally is prevented from being lowered. An imaging element includes a plurality of pixels and incident light attenuation sections. The pixel includes a color filter transmitting incident light having a predetermined wavelength, and a photoelectric conversion section that produces an electric charge according to the light transmitted through the color filter. The incident light attenuation section is disposed between the color filters of the adjacent pixels, is configured to be different in surface height from the color filters, and attenuates light not transmitted through the color filter but incident on the photoelectric conversion section of the pixel where the color filter is disposed.

A method of producing a molded product, the method including: pressing a mold having a surface including at least one of a concave part or a convex part against a photocurable positive electron beam resist; obtaining a molded product of the positive electron beam resist having a surface including a concave part and a convex part by irradiating the photocurable positive electron beam resist pressed against the resist with light to cure the resist; and partially decomposing the molded product of the positive electron beam resist in a region subjected to irradiation with an electron beam by irradiating the surface of the molded product of the positive electron beam resist with the electron beam.

An image processing device includes an image sensor and an image signal processor. The image sensor includes a pixel array and a filter array. The filter array is arranged corresponding to the pixel array and includes a plurality of filter units. The plurality of filter units divides the pixel array into a plurality of pixel units. Each pixel unit includes a plurality of pixels. Each filter unit corresponds to one pixel unit and allows only one kind of colored light to be incident on the corresponding pixel unit to generate a first Bayer image. The image signal processor is electrically coupled to the image sensor to receive the first Bayer image output by the image sensor and processes the first Bayer image to output a first image or a second image.