A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

A device for inserting a flexible printed circuit board into a connector of a display panel includes: a suction unit configured to adhere to the flexible printed circuit board; a position restriction unit configured to restrict a position of the flexible printed circuit board; and a flexible printed circuit board transfer unit coupled to the suction unit and the position restriction unit, and configured to insert the flexible printed circuit board into the connector. A method of inserting a flexible printed circuit board into a connector of a display panel is also disclosed.

A display device may include a display panel including an active area displaying an image and a peripheral area surrounding the active area, pad parts disposed on a side surface of the display panel, a light blocking layer disposed on a portion of the peripheral area adjacent to the side surface of the display panel, and circuit units electrically connected to the pad parts.

A laser irradiation apparatus includes a stage on which a substrate is provided, a laser irradiation unit which irradiates a laser to the substrate on the stage, an image acquiring unit which acquires an image of a predetermined region of the substrate, and a control unit electrically connected to the laser irradiation unit and the image acquiring unit, where the control unit calculates a brightness value corresponding to an average value of grayscale values of the image provided from the image acquiring unit, compares a calculated brightness value with a reference brightness value, and outputs data on performance of the laser based on a result of comparing the calculated brightness value with the reference brightness value.

A bonding apparatus for bonding a driving circuit to a display panel includes: a bonding stage unit on which the display panel is supported in bonding the driving circuit to the display panel; a head unit located above the bonding stage unit and with which ultrasonic waves are applied to the driving circuit to couple the driving circuit with a bonding area of the display panel supported on the bonding stage unit; and a protrusion disposed at an edge portion of the bonding stage unit, the edge portion corresponding to an end of the display panel at which the bonding area is disposed.

An aging pallet used in an aging process of a display panel is provided. The aging pallet can include a plurality of trays stacked on a driving unit. Each of the plurality of trays can include a seating portion on which the display panel is mounted, and at least one press bar disposed on the seating portion. The press bar can include protrusions protruding toward the seating portion or holes disposed at a surface of the press body toward the seating portion. Thus, the aging pallet can prevent the damage to the display panel due to particles in the aging process.

A manufacturing apparatus of a display device includes a first jig configured to hold a first member; a second jig located under the first jig and coupled to or separated from the first jig such that the first member is locatable between the first jig and the second jig; fixing parts located at both ends of the second jig and configured to hold a second member between the first member and the second jig, the second jig including a pad; and a stage located under the pad and provided with a groove formed therethrough and having an area smaller than an area of the pad when viewed in a plan view, wherein one portion of the pad, which faces the stage, is configured to be within the groove.

A processing method for a color film substrate, the color film substrate comprising a substrate, a photoresist layer, a conductive layer and a spacer layer. The photoresist layer is disposed on the substrate; the conductive layer is disposed on the photoresist layer and completely covers the photoresist layer; and the spacer layer is disposed on the conductive layer. The method comprises: detecting the spacer layer; determining whether the spacer layer meets a preset condition; if the spacer layer meets the preset condition, removing the spacer layer using a rework liquid medicine so as to expose the conductive layer; and re-preparing a spacer layer on the exposed conductive layer, wherein the etching selection ratio of the spacer layer to the conductive layer is greater than 1.

An ultrasonic bonding device includes a stage and an ultrasonic horn. A first flat member and a second flat member to be bonded are placed on the stage. The ultrasonic horn includes a press part to be pressed on a laminated portion of the first flat member and the second flat member. The stage includes a lower-side surface, a higher-side surface, and a step wall surface. The first flat member is to be placed on the lower-side surface. The higher-side surface is positioned higher than the lower-side surface by a predetermined step height. The second flat member is to be placed on the higher-side surface. The step wall surface is positioned in a boundary between the lower-side surface and the higher-side surface.

A substrate includes at least two edges; and at least one end portion, each end portion is connected to two adjacent edges. The end portion includes a cutting section and two breaking sections; an end of the cutting section is connected to one of the two adjacent edges through a breaking section, and another end of the cutting section is connected to another one of the two adjacent edges through another breaking section. The cutting section is configured to be formed through cutting of a tool, and the breaking sections are configured to be formed under an action of a physical force.