A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.

A manufacturing system is disclosed herein. The manufacturing system includes one or more stations, a monitoring platform, and a control module. Each station of the one or more stations is configured to perform at least one step in a multi-step manufacturing process for a component. The monitoring platform is configured to monitor progression of the component throughout the multi-step manufacturing process. The control module is configured to dynamically adjust processing parameters of each step of the multi-step manufacturing process to achieve a desired final quality metric for the component.

Disclosed are methods of optimizing a computer model which relates the etch profile of a feature on a semiconductor substrate to a set of independent input parameters (A), via the use of a plurality of model parameters (B). In some embodiments, the methods may include modifying one or more values of B so as to reduce a metric indicative of the differences between computed reflectance spectra generated from the model and corresponding experimental reflectance spectra with respect to one or more sets of values of A. In some embodiments, calculating the metric may include an operation of projecting the computed and corresponding experimental reflectance spectra onto a reduced-dimensional subspace and calculating the difference between the reflectance spectra as projected onto the subspace. Also disclosed are etch systems implementing such optimized computer models.

A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.

A method and apparatus for controlling a tooling operation to be performed by a tooling system in an assembly process. A current set of parameter values for a set of parameters for the tooling system are modified iteratively, until the current set of parameter values are determined to result in the tooling operation producing an output that meets a set of criteria, to form a final set of parameter values. The tooling operation is performed with the tooling system using the final set of parameter values. A determination is made as to whether the output of the tooling operation meets the set of criteria based on sensor data about the output. A new set of parameter values are identified as the current set of parameter values to be evaluated in response to a determination that the output of the tooling operation does not meet the set of criteria.

A method for adjusting at least two parameters of a coating process to manufacture a coated transparent substrate including a multi-layered coating according to a targeted value for at least one quality function for the coated transparent substrate. The method relies on a set of different mathematical prediction models in the training procedure, which, once trained, when they are used either sequentially, alternatively or in parallel, during the prediction procedure, allow to counteract or counterbalance drifts that may potentially occur from one of them. Outstanding benefits are that misbehaviours of current feedback methods may be prevented, that changes in the local atmosphere of deposit cells, and in turn in the chemistry of coated layers, which may occur from temperature and/or humidity variation, may be compensated, and that more than one coating process parameters may be adjusted at the same time.

Provided is a veneer sorting control device including: a sorting condition setting unit 11 that sets sorting conditions for each of a plurality of kinds of defects so as to sort a veneer into a plurality of quality ranks; a defect detection unit 13 that detects the plurality of kinds of defects with respect to each of a plurality of pieces of veneer image data acquired from an image storage unit 100; a quality rank sorting unit 14 that sorts a plurality of the veneers into a plurality of quality ranks in correspondence with the sorting conditions which are set and defect detection states; a first totalization unit 15 that totalizes the number or a number ratio of the veneers in the plurality of quality ranks which are sorted; and a display control unit 17 that displays the totalization result on a screen. The number of the veneers sorted into the plurality of quality ranks can be confirmed by a simulation using the veneer image data stored in the image storage unit 100.

A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.

A worked surface of a workpiece is evaluated on the basis of how the surface is actually perceived by a person's (observer's) eyes (vision) or fingers (touch), and a work process whereby a workpiece is worked is changed on the basis of the evaluation.

A manufacturing system is disclosed herein. The manufacturing system includes one or more stations, a monitoring platform, and a control module. Each station of the one or more stations is configured to perform at least one step in a multi-step manufacturing process for a component. The monitoring platform is configured to monitor progression of the component throughout the multi-step manufacturing process. The control module is configured to dynamically adjust processing parameters of each step of the multi-step manufacturing process to achieve a desired final quality metric for the component.