Embodiments disclosed herein generally relate to methods, systems, and non-transitory computer readable medium for scheduling a substrate processing sequence in an integrated substrate processing system. A client device assigns a processing sequence to each substrate in a batch of substrates to be processed. The client device assigns a processing chamber to each process in the process sequence for each processing chamber in the integrate substrate processing system. The client device generates a processing model for the batch of substrates. The processing model defines a start time for each substrate in each processing chamber. The client device generates a timetable for the batch of semiconductor substrates based off the processing model. The client device processes the batch of substrates in accordance with the timetable.

The example embodiments are directed to a system and method for analyzing different production events as a group by modeling the production events as intervals of time. In one example, the method includes modeling a plurality of production processes as a plurality of intervals of time which are overlapping one another on a graph over a predetermined period of time, each modeled production process including a sequence of events over time, determining a slice of time on the graph within the predetermined period of time based on event timings within the plurality of production process, identifying an event that is occurring in each production process during the slice of time based on the overlapping plurality of intervals of time, and storing the identified events of each production process together as a group along with an identification of the slice of time.

The invention relates to production planning systems and methods. A production optimization system is provided which has the following: a production environment with at least one first machine, a second machine, a distribution unit configured to be connected to the first machine and the second machine via a communication network and to ascertain the machine state thereof, and an optimization unit configured to generate a production plan where at least one task for producing a product is separated into machine-specific sub-tasks for the first machine or the second machine, said sub-tasks being provided with a sequence for the first machine or the second machine. The distribution unit ascertains the next occurring sub-task for the first machine or the second machine from the optimization unit while taking into consideration the respective machine state, to remove the sub-task from the production plan, and to assign the sub-task to the respective machine.

Embodiments disclosed herein generally relate to methods, systems, and non-transitory computer readable medium for scheduling a substrate processing sequence in an integrated substrate processing system. A client device assigns a processing sequence to each substrate in a batch of substrates to be processed. The client device assigns a processing chamber to each process in the process sequence for each processing chamber in the integrate substrate processing system. The client device generates a processing model for the batch of substrates. The processing model defines a start time for each substrate in each processing chamber. The client device generates a timetable for the batch of semiconductor substrates based off the processing model. The client device processes the batch of substrates in accordance with the timetable.

A method of dispatching wafer lots through a plurality of process chambers, wherein the process chambers are disposed in at least one machine. The method includes: receiving wafer lot information and process chamber data, wherein the wafer lot information identifies the wafer lots to be processed at the machine, and the process chamber data includes process information associated with the process chambers; determining a load factor of each process chamber based on the wafer lot information and process chamber data; receiving historical data of run lots previously processed through the process chambers, and determining a processing time of the wafer lots based on the historical data; generating a dispatching criteria for the wafer lots based on the load factors of the process chambers and the determined processing time of the wafer lots; and dispatching the wafer lots through the process chambers based on the dispatching criteria.

A method and system for automatically monitoring operations of a production line as a function of a takt time, includes: a) receiving or acquiring a takt time for production of a product by the production line; b) receiving or acquiring a set of successive operations to be performed on the product by equipment of the production line, each operation being distinguished by a duration defined as a function of the takt time; c) acquiring in real time from the equipment of the production line a temporal progression or evolution of each successive operation; e) automatically determining from the temporal progression or evolution a predicted end of one or each of the successive operations; f) automatically determining whether at least one predicted end exceeds an expected end of the operation; and g) in the affirmative, automatically triggering or activating a measure keeping the production rate equal to the takt time.