A device includes a plurality of blocks. Each block of the plurality of blocks includes a plurality of rows. Each row of the plurality of rows includes a plurality of configurable elements and a routing line, whereby each configurable element of the plurality of configurable elements includes a data analysis element comprising a plurality of memory cells, wherein the data analysis element is configured to analyze at least a portion of a data stream and to output a result of the analysis. Each configurable element of the plurality of configurable elements also includes a multiplexer configured to transmit the result to the routing line.

A device includes a plurality of blocks. Each block of the plurality of blocks includes a plurality of rows. Each row of the plurality of rows includes a plurality of configurable elements and a routing line, whereby each configurable element of the plurality of configurable elements includes a data analysis element comprising a plurality of memory cells, wherein the data analysis element is configured to analyze at least a portion of a data stream and to output a result of the analysis. Each configurable element of the plurality of configurable elements also includes a multiplexer configured to transmit the result to the routing line.

A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

A system on-chip includes a central processing unit and a memory controller. The memory controller receives initialization information indicating an initialization address range and an initialization value from the central processing unit, determines an initialization target memory and a local initialization address range of the initialization target memory based on the initialization information, and transmits initialization data including the initialization value to the initialization target memory by a predetermined unit to initialize the local initialization address range of the initialization target memory.

A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

A device includes a plurality of blocks. Each block of the plurality of blocks includes a plurality of rows. Each row of the plurality of rows includes a plurality of configurable elements and a routing line, whereby each configurable element of the plurality of configurable elements includes a data analysis element comprising a plurality of memory cells, wherein the data analysis element is configured to analyze at least a portion of a data stream and to output a result of the analysis. Each configurable element of the plurality of configurable elements also includes a multiplexer configured to transmit the result to the routing line.

A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

A method of interleaved processing (IP) is proposed which generalizes the functional principle of memory interleaving by extending the interleaved memory system into the processor chip and prepending each write access to one of the extended interleaved memory banks by a data transforming operation. The method opens a new dimension of large scale software parallelization and is implemented in autonomous processing units called parallel processing channels (PPC) that integrate processor and memory at a very low machine balancewhich solves the memory wall problemand execute on-chip machine transactions at a 1 Flop/cycle throughput. If computing systems are linearly performance scalable and capable of pipelined execution of very large and complex HPC workloads. They have unique performance advantages in strided vector, tensor, and data set operations; for relevant HPC workload types, up to 10-100 per-Watt single-processor performance gains compared to today's technologies are expected.