Example computational storage systems and methods are described. In one implementation, a storage drive controller includes a non-volatile memory subsystem to process multiple commands. Multiple versatile processing arrays are coupled to the non-volatile memory subsystem. The multiple versatile processing arrays can process multiple in-situ tasks. A host direct memory access module provides direct access to at least one memory device.

Example computational storage systems and methods are described. In one implementation, a storage drive controller includes a non-volatile memory subsystem to process multiple commands. Multiple versatile processing arrays are coupled to the non-volatile memory subsystem. The multiple versatile processing arrays can process multiple in-situ tasks. A host direct memory access module provides direct access to at least one memory device.

Functional units disposed in one or more processor cores are communicatively coupled using both a shared bypass network and a switched network. The shared bypass network enables the functional units to be operated conventionally for general processing while the switched network enables specialized processing in which the functional units are configured as a spatial array. In the spatial array configuration, operands produced by one functional unit can only be sent to a subset of functional units to which dependent instructions have been mapped a priori. The functional units may be dynamically reconfigured at runtime to toggle between operating in the general configuration and operating as the spatial array. Information to control the toggling between operating configurations may be provided in instructions received by the functional units.

A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

A network topology system comprises a plurality of nodes, each of the plurality of nodes having a set of connection rules which is built by the steps of: generating a series of prime number differences; generating a series of communication strategy numbers; extracting as many terms as the number of connecting nodes from a recursive sequences to serve as an index series; generating a series of connection strategy numbers by extracting the Nth terms from the series of communication strategy numbers, wherein N stands for each number of the index series; and generating a series of connecting nodes numbers by calculating the sum of each odd number and each term of the series of connection strategy numbers so as to build the connection rules for each odd-numbered node to connect the nodes numbered in corresponding with the numbers of the connecting nodes number series.

A discrete three-dimensional (3-D) processor comprises first and second dice. The first die comprises 3-D memory (3D-M) arrays and in-die peripheral-circuit components thereof, whereas the second die comprises processing circuits and off-die peripheral-circuit components of the 3D-M arrays. The first and second dice are communicatively coupled by a plurality of inter-die connections.

An array of processing elements are arranged in a three-dimensional array. Each of the processing elements includes or is coupled to a dedicated memory. The processing elements of the array are intercoupled to their nearest neighbor processing elements. A processing element on a first die may be intercoupled to a first processing element on a second die that is located directly above the processing element, a second processing element on a third die that is located directly below the processing element, and the four adjacent processing elements on the first die. This intercoupling allows data to flow from processing element to processing element in the three directions. These dataflows are reconfigurable so that they may be optimized for the task. The data flows of the array may be configured into one or more loops that periodically recycle data in order to accomplish different parts of a calculation.

A discrete three-dimensional (3-D) processor comprises first and second dice. The first die comprises 3-D memory (3D-M) arrays and in-die peripheral-circuit components thereof, whereas the second die comprises processing circuits and off-die peripheral-circuit components of the 3D-M arrays. The first and second dice are communicatively coupled by a plurality of inter-die connections.

A discrete three-dimensional (3-D) processor comprises first and second dice. The first die comprises 3-D random-access memory or 3-D read-only memory (3D-RAM/3D-ROM) arrays, whereas the second die comprises logic circuits and at least an off-die peripheral-circuit component of the 3D-RAM/3D-ROM arrays. The first die does not comprise the off-die peripheral-circuit component of the 3D-RAM/3D-ROM arrays.

A discrete three-dimensional (3-D) processor comprises communicatively coupled first and second dice. The first die comprises 3-D memory (3D-M) arrays, whereas the second die comprises at least a non-memory circuit and at least an off-die peripheral-circuit component of the 3D-M arrays. The first die does not comprise said off-die peripheral-circuit component. The non-memory circuit on the second die is not part of a memory.