Patent classifications
G06K19/12
IDENTIFICATION CARD
An identification card includes a ceramic substrate with opposite surfaces, and an accommodating part. A marking joint part is arranged in the accommodating part, and the orthogonal projection of the accommodating part on the ceramic substrate covers the orthogonal projection of the marking joint part on the ceramic substrate. The marking joint part includes a bearing layer and a marking part arranged on the bearing layer. The bearing layer and the marking part are of an integrated structure. The ceramic substrate is provided with an accommodating part for setting a marking joint part to ensure the flatness of the identification card, and the orthogonal projection of the accommodating part on the ceramic substrate covers the orthogonal projection of the marking joint part on the ceramic substrate.
IDENTIFICATION CARD
An identification card includes a ceramic substrate with opposite surfaces, and an accommodating part. A marking joint part is arranged in the accommodating part, and the orthogonal projection of the accommodating part on the ceramic substrate covers the orthogonal projection of the marking joint part on the ceramic substrate. The marking joint part includes a bearing layer and a marking part arranged on the bearing layer. The bearing layer and the marking part are of an integrated structure. The ceramic substrate is provided with an accommodating part for setting a marking joint part to ensure the flatness of the identification card, and the orthogonal projection of the accommodating part on the ceramic substrate covers the orthogonal projection of the marking joint part on the ceramic substrate.
Metallic transaction cards
A transaction card includes an anodized card body having a front and rear face. Various information and security features may be provided on the front face and on the rear face. A magnetic stripe may be provided on the rear face of the anodized card body. The magnetic stripe may be adhered within a slot formed within the rear face of the anodized body. Alternatively, the magnetic stripe may be provided via an overlay that is adhered to the rear face of the anodized body, and the magnetic stripe may be integral with the overlay or adhered to the overlay after the overlay is applied to the anodized card body. The transaction card may also include a hologram. The hologram may be integral with the overlay or may be applied to the overlay that has been arranged on the anodized card body.
METALLIC TRANSACTION CARDS
A transaction card includes an anodized card body having a front and rear face. Various information and security features may be provided on the front face and on the rear face. A magnetic stripe may be provided on the rear face of the anodized card body. The magnetic stripe may be adhered within a slot formed within the rear face of the anodized body. Alternatively, the magnetic stripe may be provided via an overlay that is adhered to the rear face of the anodized body, and the magnetic stripe may be integral with the overlay or adhered to the overlay after the overlay is applied to the anodized card body. The transaction card may also include a hologram. The hologram may be integral with the overlay or may be applied to the overlay that has been arranged on the anodized card body.
Metallic transaction cards
A transaction card includes an anodized card body having a front and rear face. Various information and security features may be provided on the front face and on the rear face. A magnetic stripe may be provided on the rear face of the anodized card body. The magnetic stripe may be adhered within a slot formed within the rear face of the anodized body. Alternatively, the magnetic stripe may be provided via an overlay that is adhered to the rear face of the anodized body, and the magnetic stripe may be integral with the overlay or adhered to the overlay after the overlay is applied to the anodized card body. The transaction card may also include a hologram. The hologram may be integral with the overlay or may be applied to the overlay that has been arranged on the anodized card body.
COMMUNICATION DEVICE, MAGNETIC TAPE CARTRIDGE UNIT AND MANUFACTURING METHOD THEREOF, AND NONCONTACT MANAGEMENT METHOD OF MAGNETIC TAPE CARTRIDGE
A magnetic tape cartridge unit includes a plurality of magnetic tape cartridges stacked in a height direction. Each magnetic tape cartridge includes an antenna coil formed in a substrate, a communication circuit that communicates with a communicatee using power induced by application of a magnetic field from the communicatee to the antenna coil, and a case having a reference plane being a reference in a height direction. The substrate is inclined at an inclination angle of less than 45 degrees with respect to the reference plane. In a case where the plurality of magnetic tape cartridges are stacked in a predetermined orientation in the height direction, the reference planes of the plurality of magnetic tape cartridges are in parallel, and the inclination angles of the substrates relative to the reference planes and positions of the substrates in the reference planes conform among the plurality of magnetic tape cartridges.
Method for forming and detecting security elements on the surface of a component or in a component, and system for detecting said security element
The invention relates to a method for forming and detecting security elements on the surface of a component and/or in a component, in which at least one layer or at least one region that is preferably formed of a magnetic material or of a material different from the component material is formed on the surface of the component and/or in the component that is formed of a magnetic or of a nonmagnetic material in a locally and geometrically defined manner. At least one ablated track, at least one heat-affected region and/or at least one remelted treatment track are/is formed by a locally and geometrically defined ablation of material or input of energy on/at the surface of a component along a predefined contour corresponding to the respective security feature. In the manufacture of the component, a magnetic material different from the material of the component is introduced into the component at at least one predefined position in a locally and geometrically defined manner by way of a generative production process. To detect the security element, a magnetization unit is used to generate at least one magnetic field penetrating into the component or a magnetic flux is produced inside the magnetization unit that penetrates into the component. To check a security element formed in this way, a detection unit is used to detect the magnetic stray fields occurring on the security element as a result of the at least one magnetic field, and the measurement signals captured by the detection unit are transferred to an evaluation unit having an image-processing or pattern-recognition system. Using the evaluation unit having an image-processing or pattern-recognition system, it is checked, by way of the detected magnetic stray fields, whether or not the detected security element corresponds to a specification.
Method for forming and detecting security elements on the surface of a component or in a component, and system for detecting said security element
The invention relates to a method for forming and detecting security elements on the surface of a component and/or in a component, in which at least one layer or at least one region that is preferably formed of a magnetic material or of a material different from the component material is formed on the surface of the component and/or in the component that is formed of a magnetic or of a nonmagnetic material in a locally and geometrically defined manner. At least one ablated track, at least one heat-affected region and/or at least one remelted treatment track are/is formed by a locally and geometrically defined ablation of material or input of energy on/at the surface of a component along a predefined contour corresponding to the respective security feature. In the manufacture of the component, a magnetic material different from the material of the component is introduced into the component at at least one predefined position in a locally and geometrically defined manner by way of a generative production process. To detect the security element, a magnetization unit is used to generate at least one magnetic field penetrating into the component or a magnetic flux is produced inside the magnetization unit that penetrates into the component. To check a security element formed in this way, a detection unit is used to detect the magnetic stray fields occurring on the security element as a result of the at least one magnetic field, and the measurement signals captured by the detection unit are transferred to an evaluation unit having an image-processing or pattern-recognition system. Using the evaluation unit having an image-processing or pattern-recognition system, it is checked, by way of the detected magnetic stray fields, whether or not the detected security element corresponds to a specification.
Chip card
A chip card is provided. The chip card can have a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer, a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module, and the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.
Chip card
A chip card is provided. The chip card can have a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer, a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module, and the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.