A switch device according to an embodiment of the present disclosure includes a first electrode; a second electrode opposed to the first electrode; and a switch layer including selenium (Se), at least one kind of germanium (Ge) or silicon (Si), boron (B), carbon (C), (Ga), and arsenic (As), and provided between the first electrode and the second electrode.

A method of forming an array of cross point memory cells comprises using two, and only two, masking steps to collectively pattern within the array spaced lower first lines, spaced upper second lines which cross the first lines, and individual programmable devices between the first lines and the second lines where such cross that have an upwardly open generally U-shape vertical cross-section of programmable material laterally between immediately adjacent of the first lines beneath individual of the upper second lines. Arrays of cross point memory cells independent of method of manufacture are disclosed.

Technologies relating to CMOS image sensors with integrated Resistive Random-Access Memory (RRAMs) units that provide energy efficient analog storage, ultra-high speed analog storage, and in-memory computing functions are disclosed. An example CMOS image sensor with integrated RRAM crossbar array circuit includes a CMOS image sensor having multiple pixels configured to receive image signals; a column decoder configured to select the pixels in columns to read out; a row decoder configured to select the pixels in rows to read out; an amplifier configured to amplify first signals received from the CMOS image sensor; a multiplexer configured to sequentially or serially read out second signals received from the amplifier; and a first RRAM crossbar array circuit configured to store third signals received from the multiplexer.

Provided is a storage device that includes a plurality of first wiring lines including a plurality of first and second selection lines, a plurality of second wiring lines including a plurality of third and fourth selection lines, a first selection line driver that applies a first voltage and a second voltage to one or more selection lines of the plurality of first and second selection lines respectively, the first voltage and the second voltage being one of a first and a second selection voltage, and the first and the second voltage are different, and a second selection line driver that applies a third voltage and a fourth voltage to one or more selection lines of the plurality of third and fourth selection lines respectively, the third voltage and the fourth voltage being one of the first and the second selection voltage, and the third and the fourth voltage being different.

A switch device according to an embodiment of the present disclosure includes a first electrode; a second electrode opposed to the first electrode; and a switch layer including selenium (Se), at least one kind of germanium (Ge) or silicon (Si), boron (B), carbon (C), (Ga), and arsenic (As), and provided between the first electrode and the second electrode.

A computer implemented method includes updating weight values associated with a plurality of analog synapses in a cross-bar array that implements an artificial neural network by sending a pulse sequence to the analog synapses. Each analog synapse includes a conductance unit, wherein a weight value of the analog synapse is based on a conductance value of the conductance unit. The pulse sequence changes the conductance value. The method further includes comparing the weight values of the analog synapses with target weight values associated with the analog synapses and selecting a set of analog synapses based on the comparison. The method further includes updating the weight values of the selected analog synapses by sending a set of electric pulses of varying durations.

A storage device includes a first electrode, a second electrode, and a storage layer. The second electrode is disposed to oppose the first electrode. The storage layer is provided between the first electrode and the second electrode, and includes one or more chalcogen elements selected from tellurium (Te), selenium (Se), and sulfur (S), transition metal, and oxygen. The storage layer has a non-linear resistance characteristic, and the storage layer is caused to be in a low-resistance state by setting an application voltage to be equal to or higher than a predetermined threshold voltage and is caused to be in a high-resistance state by setting the application voltage to be lower than the predetermined threshold voltage to thereby have a rectification characteristic.

A method to adaptively and dynamically set a bias scheme of a crossbar array for a write operation includes: performing a read-before-write operation to determine a number of cells n to be written during a write operation; comparing n to a predetermined threshold value to determine an efficient bias scheme; setting at least one voltage regulator to provide a bias voltage according to the efficient bias scheme; and performing the write operation. A method to determine threshold value to determine an efficient bias scheme of a crossbar array and an energy efficient crossbar array device are also described.

One embodiment provides an apparatus. The apparatus includes a pair of nonvolatile resistive random access memory (RRAM) memory cells coupled to a volatile static RAM (SRAM) memory cell. The pair of nonvolatile RRAM memory cells includes a first RRAM memory cell and a second RRAM memory cell. The first RRAM memory cell includes a first resistive memory element coupled to a first bit line, and a first selector transistor coupled between the first resistive memory element and a first output node of the volatile SRAM memory cell. The second RRAM memory cell includes a second resistive memory element coupled to a second bit line, and a second selector transistor coupled between the second resistive memory element and a second output node of the volatile SRAM memory cell.

Provided is an initialization control unit that causes a resistance value of a variable resistive element in an access restriction region to be changed to an initial value larger than a predetermined value. The resistance value is changed in a read only mode among the read only mode in which writing to the access restriction region is prohibited and a writable mode in which the writing to the access restriction region is permitted. The access restriction region is in a memory cell array in which the variable resistive elements are arranged, and the initialization control unit transitions to the writable mode. In addition, a write control unit causes a resistance value of an element corresponding to write data among the variable resistive elements in the access restriction region to be changed to a value smaller than the initial value in the writable mode, and transitions to the read only mode.