There are provided a memory device and an operating method thereof. The memory device includes: a memory block including a plurality of memory cells; and a peripheral circuit for performing a program operation and an erase operation on the memory block. The program operation is performed by using a hole injection method, and the erase operation is performed by using an electron charging method. The plurality of memory cells are programmed when a threshold voltage of each of at least some of the plurality of memory cells is decreased to be less than a set level in the program operation, and are erased when the threshold voltage of each of the plurality of memory cells is increased to be the set level or higher in the erase operation.

Apparatuses, systems, and methods are disclosed for concurrently programming non-volatile storage cells, such as those of an SLC NAND array. The non-volatile storage cells may be arranged into a first block comprising a first string of storage cells that intersects with a first word line at a first storage cell, a second block comprising a second string of storage cells that intersects with a second word line at a second storage cell, a bit line electrically connectable to the first string and the second string, and controller configured to apply a programming pulse, at an elevated voltage, to the first word line and second word line to concurrently program the first and second storage cells.

Technology is disclosed herein for concurrently programming the same data pattern in multiple sets of non-volatile memory cells. Voltage are applied to bit lines in accordance with a data pattern. A select voltage is applied to drain select gates of multiple sets of NAND strings. The system concurrently applies a program pulse to control gates of a different set of selected memory cells in each respective set of the multiple sets of the NAND strings while the select voltage is applied to the drain select gates of the multiple sets of the NAND strings and the voltages are applied to the plurality of bit lines to concurrently program the data pattern into each set of the selected memory cells.

Described herein are embodiments related to first-pass dynamic program targeting (DPT) operations on memory cells of memory systems. A method includes determining that a first programming pass of a programming operation has been performed on a memory cell of the memory component, and performing a dynamic program targeting (DPT) operation on the memory cell to calibrate a first program-verify (PV) target value that results in an adjustment to a placement of a first first-pass programming distribution and a second PV target value that results in an adjustment to a placement of a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

There are provided a memory device and an operating method thereof. The memory device includes: a memory block including a plurality of memory cells; and a peripheral circuit for performing a program operation and an erase operation on the memory block. The program operation is performed by using a hole injection method, and the erase operation is performed by using an electron charging method. The plurality of memory cells are programmed when a threshold voltage of each of at least some of the plurality of memory cells is decreased to be less than a set level in the program operation, and are erased when the threshold voltage of each of the plurality of memory cells is increased to be the set level or higher in the erase operation.

An indication to perform a write operation at a memory component can be received. A voltage pulse can be applied to a destination block of the memory component to store data of the write operation, the voltage pulse being at a first voltage level associated with a programmed state. An erase operation for the destination block can be performed to change the voltage state of the memory cell from the programmed state to a second voltage state associated with an erased state. A write operation can be performed to write the data to the destination block upon changing the voltage state of the memory cell to the second voltage state.

Apparatuses, systems, and methods are disclosed for concurrently programming non-volatile storage cells, such as those of an SLC NAND array. The non-volatile storage cells may be arranged into a first block comprising a first string of storage cells that intersects with a first word line at a first storage cell, a second block comprising a second string of storage cells that intersects with a second word line at a second storage cell, a bit line electrically connectable to the first string and the second string, and controller configured to apply a programming pulse, at an elevated voltage, to the first word line and second word line to concurrently program the first and second storage cells.

Described herein are embodiments related to first-pass dynamic program targeting (DPT) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device, before a second programming pass of the programming operation is performed on the memory cell, determines information about a first programming distribution and a second programming distribution of the memory cell, the first programming distribution corresponding to a first page type and the second programming distribution corresponding to a second page type. The processing device adjusts, using the information, a placement of the first programming distribution relative to the second programming distribution that balances a bit error rate (BER) between the first page type and the second page type.

A request to perform a write operation at a memory component can be received. A destination block of the memory component to store data of the write operation can be determined. A voltage pulse can be applied to the destination block that places a memory cell of the destination block at a voltage level associated with a high voltage state. Responsive to applying the voltage pulse to the destination block, an erase operation for the destination block can be performed to change the voltage level of the memory cell from the high voltage state to a low voltage state. A write operation can be performed to write the data to the destination block that is at the low voltage state.

Apparatuses, systems, and methods are disclosed for concurrently programming non-volatile storage cells, such as those of an SLC NAND array. The non-volatile storage cells may be arranged into a first block comprising a first string of storage cells that intersects with a first word line at a first storage cell, a second block comprising a second string of storage cells that intersects with a second word line at a second storage cell, a bit line electrically connectable to the first string and the second string, and controller configured to apply a programming pulse, at an elevated voltage, to the first word line and second word line to concurrently program the first and second storage cells.