According to an embodiment, a semiconductor memory device includes a first pin, a first receiving circuit, and a first terminating circuit. The first pin receives a first signal and a second signal having a smaller amplitude than the first signal. The first receiving circuit is connected to the first pin and outputs, based on a comparison between the first signal and a first voltage, a third signal. The first receiving circuit also outputs, based on a comparison between the second signal and a second voltage, a fourth signal having a smaller amplitude than the third signal. The first terminating circuit is connected to the first pin. The first terminating circuit is disabled if the first pin receives the first signal, and enabled if the first pin receives the second signal.

Memory devices and methods of operating memory devices in which maintenance operations can be scheduled on an as-needed basis for those memory portions where activity (e.g., operations in excess of a predetermined threshold) warrants a maintenance operation are disclosed. In one embodiment, an apparatus comprises a memory including a memory location, and circuitry configured to determine a count corresponding to a number of operations at the memory location, to schedule a maintenance operation for the memory location in response to the count exceeding a first predetermined threshold, and to decrease the count by an amount corresponding to the first predetermined threshold in response to executing the scheduled maintenance operation. The circuitry may be further configured to disallow, in response to determining that the count has reached a maximum permitted value, further operations at the memory location until after the count has been decreased.

Apparatuses and methods for setting a duty cycler adjuster for improving clock duty cycle are disclosed. The duty cycle adjuster may be adjusted by different amounts, at least one smaller than another. Determining when to use the smaller adjustment may be based on duty cycle results. A duty cycle monitor may have an offset. A duty cycle code for the duty cycle adjuster may be set to an intermediate value of a duty cycle monitor offset. The duty cycle monitor offset may be determined by identifying duty cycle codes for an upper and for a lower boundary of the duty cycle monitor offset.

A semiconductor chip capable of improving signal quality includes a host device, a first memory device which is spaced part from the host device and connected to the host device, a repeater module which is connected to the host device and the first memory device, and a second memory device which is spaced apart from the host device and connected to the repeater module. The first memory device receives a data signal from the host device and generates a recovery clock signal, using the data signal. The repeater module receives the recovery clock signal from the first memory device, receives a first input signal from the host device, and samples the first input signal on the basis of the recovery clock signal to generate a sampling signal. The second memory device receives the sampling signal.

A semiconductor integrated circuit has a reception circuit configured to receive a strobe signal of which a logic is intermittently switched in synchronization with a data signal, an output circuit configured to extract a low frequency component including at least a DC component of the strobe signal received by the reception circuit and to output a first signal, and a comparison circuit configured to compare a signal level of the first signal with a threshold level. The reception circuit is configured to change a boost amount of a high frequency component different from the low frequency component of the strobe signal based on a comparison result obtained by the comparison circuit.

A voltage regulator and a semiconductor memory device having the same are disclosed. The voltage regulator includes an amplifier configured to amplify a difference between a reference voltage and a feedback voltage to generate an amplifier output voltage, a voltage feedback unit connected between an output supply voltage generation node and a ground voltage and configured to generate the feedback voltage, a first transfer gate unit connected between an input supply voltage and the voltage generation node and driven in response to the amplifier output voltage to provide first current, a current load replica unit connected between the voltage generation node and the ground voltage and configured to consume the first current, and a transfer unit connected between the input supply voltage and the voltage generation node and driven in response to the amplifier output voltage when the current load unit performs an operation, to provide second current.

An electronic circuit includes a memory buffer and control logic. The memory buffer is configured to transfer data from a first domain to a second domain of the circuit, the first and the second domains operate in synchronization with respective clock signals. The control logic is configured to maintain a write indicator in the first domain indicative of a next write position in the memory buffer for storing data, to maintain a read indicator in the second domain indicative of a next read position in the memory buffer for retrieving the stored data, to generate in the second domain, based on the write and the read indicators, a first signal that is indicative of whether the memory buffer has data for reading or has become empty, and retain the first signal in a state that indicates that the memory buffer has become empty, until writing to the memory buffer resumes.

Memory controllers, devices, modules, systems and associated methods are disclosed. In one embodiment, an integrated circuit (IC) memory controller is disclosed. The IC memory controller includes a first controller command/address (C/A) interface to transmit first and second read commands for first and second read data to a first memory C/A interface of a first bank group of memory. A second command/address (C/A) interface transmits third and fourth read commands for third and fourth read data to a second memory C/A interface of a second bank group of memory. Receiver circuitry receives the first and second read data via a first data link interface and the third and fourth read data via the second data link interface. For a first operating mode, the first and second read data are received after respective first delays following transmission of the first and second read commands and at a first serialization ratio. For a second operating mode, the first and second read data are received after respective second and third delays following transmission of the first and second read commands. The second and third delays are different from the first delays and from each other. The first and second data are received at a second serialization ratio that is different than the first serialization ratio.

A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

A semiconductor memory device includes an interface semiconductor die, at least one memory semiconductor die, and through-silicon vias connecting the interface semiconductor die and the memory semiconductor die. The interface semiconductor die includes command pins to receive command signals transferred from a memory controller and an interface command decoder to decode the command signals. The memory semiconductor die includes a memory integrated circuit configured to store data and a memory command decoder to decode the command signals transferred from the interface semiconductor die. The interface semiconductor die does not include a clock enable pin to receive a clock enable signal from the memory controller. The interface and memory command decoders generate interface and memory clock enable signals to control clock supply with respect to the interface and memory semiconductor dies based on a power mode command transferred through the plurality of command pins from the memory controller.