According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a cam-position including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.

An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.

An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.

PROBLEM: To provide a multi-layer preform sheet capable of forming a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion and so forth that are less likely to produce the Kirkendall void.

SOLUTION: A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300° C. or above, and a second metal capable of forming an intermetallic compound with the first metal.

An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.

An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.

The present invention relates to a MXene electrode for electronic products having excellent oxidation stability and flexibility and a method for manufacturing the same, and more specifically to a MXene electrode which has excellent stability from changes such as oxidation in a driving environment, excellent transparency and mechanical properties and high electrical conductivity such that it is appropriate to be used as a transparent electrode in electronic devices, and a method for manufacturing the same.

The present invention relates to a MXene electrode for electronic products having excellent oxidation stability and flexibility and a method for manufacturing the same, and more specifically to a MXene electrode which has excellent stability from changes such as oxidation in a driving environment, excellent transparency and mechanical properties and high electrical conductivity such that it is appropriate to be used as a transparent electrode in electronic devices, and a method for manufacturing the same.

According to embodiments of the present invention, a stranded conductor is formed in which the occurrence of defects, such as strand unevenness of filaments and outward protrusion of filaments, is inhibited. According to embodiments of the present invention, a stranded conductor (1a) includes soft filaments (2a) stranded together. The soft filaments (2a) include a soft filament made of an aluminum material, disposed along a center (101), and include six soft filaments, twelve soft filaments, and eighteen soft filaments made of an aluminum material, disposed around and concentrically with the center. The filaments are softened filaments that are softened. A lay length (Pa) is from 6.2 times to 15.7 times a conductor diameter of the stranded conductor.

The present invention relates to core shell liquid metal encapsulates comprising and processes of making and using such encapsulates and networks. The shell(s) of such encapsulates employ a palette of materials having widely varied band structures and/or the desired spin pairing and/or bond polarization. Such encapsulates can be designed to respond to one or more stimuli of choice, including but not limited to electromagnetic, thermal, mechanical, photonic, and/or magnetic and are environmentally robust.