An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

A flow-guiding rod includes a cooling channel provided in a rod portion of the flow-guiding rod, and a coolant inlet pipe and a coolant outlet pipe provided on end(s) of the flow-guiding rod. The coolant inlet pipe and the coolant outlet pipe are communicated with the cooling channel.

A surge arrester system includes a surge arrester, and an active cooling system having a cooling interface in contact with the surge arrester and operative to transfer heat from the surge arrester. The active cooling system includes a forced convection apparatus operative to provide forced convection cooling. A circuit breaker system includes a power semiconductor switch and an active cooling system constructed to cool the power semiconductor switch. The active cooling system includes a forced convection apparatus configured to provide forced convection cooling. The power semiconductor switch is in contact with the active cooling system. A surge arrester is disposed adjacent to and in contact with the active cooling system. The active cooling system includes a cooling interface constructed for contact with the surge arrester and operative to provide cooling to the surge arrester. The power semiconductor switch and the surge arrester dissipate power alternatively.

A surge arrester system includes a surge arrester, and an active cooling system having a cooling interface in contact with the surge arrester and operative to transfer heat from the surge arrester. The active cooling system includes a forced convection apparatus operative to provide forced convection cooling. A circuit breaker system includes a power semiconductor switch and an active cooling system constructed to cool the power semiconductor switch. The active cooling system includes a forced convection apparatus configured to provide forced convection cooling. The power semiconductor switch is in contact with the active cooling system. A surge arrester is disposed adjacent to and in contact with the active cooling system. The active cooling system includes a cooling interface constructed for contact with the surge arrester and operative to provide cooling to the surge arrester. The power semiconductor switch and the surge arrester dissipate power alternatively.

Provided is a film having excellent electrical insulation performance, heat dissipation performance, and workability. In addition, by using the film, provided are an electrical insulation sheet having excellent heat conductivity, a rotating machine using the sheet, an adhesive tape, and the like. The number of coarse projections SPc (4000) on at least one surface of the film is 15 projections/mm.sup.2 or greater.

Provided is a film having excellent electrical insulation performance, heat dissipation performance, and workability. In addition, by using the film, provided are an electrical insulation sheet having excellent heat conductivity, a rotating machine using the sheet, an adhesive tape, and the like. The number of coarse projections SPc (4000) on at least one surface of the film is 15 projections/mm.sup.2 or greater.

A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.

A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.

An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.