The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.

An inductor array includes a magnetic base body having first and second surfaces opposed to each other and a third surface connecting between the first and second surfaces, and also includes first and second end internal conductors having the same shape. The first end internal conductor includes first-end first conductor portions and fewer first-end second conductor portions, alternating with and being connected to each other. The second end internal conductor includes second-end first conductor portions and fewer second-end second conductor portions, alternating with and being connected to each other. The first-end first conductor portions are positioned away from the first surface by a first end distance in a reference axis direction and face the first surface. The second-end second conductor portions are positioned away from the second surface by a second end distance less than the first end distance in the reference axis direction and face the second surface.

A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.

A heating, ventilation, and/or air conditioning (HVAC) system includes a transformer mounted to a control panel and having a first mounting flange and a fuse block mounting bracket extending about the transformer. The fuse block mounting bracket includes a second mounting flange engaged with the first mounting flange. The HVAC system also includes a fuse block mounted to the fuse block mounting bracket.

A multi-layer coil structure and an inductor are provided. The multi-layer coil structure includes a first coil body and a second coil body. The first coil body includes a first extension portion and a second extension portion extending in a first direction, and at least one third extension portion extending in a second direction. The second coil body includes a fourth extension portion, a fifth extension portion, and at least one sixth extension portion, the fourth extension portion and the fifth extension portion extend in the first direction, and the at least one sixth extension portion extend in the second direction. When the first coil body is detachably assembled with the second coil body, at least one first pin is formed by the first extension portion and the fourth extension portion, and at least one second pin is formed by the second extension portion and the fifth extension portion.

An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.

A coil component comprising a core including a winding core having a shape extending in a constant direction, a first flange disposed at a first end in an extending direction of the winding core, and a second flange disposed at a second end in the extending direction of the winding core; first and second electrodes disposed on the first flange; third and fourth electrodes disposed on the second flange; and a coil including a first wire wound around the winding core and electrically connected to the first and third electrodes, and a second wire electrically connected to the second and fourth electrodes. The first and second flanges each have an inner surface facing the winding core, an outer surface facing toward the side opposite to the inner surface, a lower surface connecting the inner and outer surfaces, and an upper surface facing the side opposite to the lower surface.

A mounting structure for mounting inductors to suppress cross talk and a stub effect due to a mounting land, and reduce deterioration of signal transmission characteristics. A first Bias-T inductor is mounted on a circuit board with one electrode terminal connected to a first mounting land with an axial direction of the first Bias-T inductor oriented perpendicular to the first mounting land and the one electrode terminal extends along the first mounting land. A second Bias-T inductor is mounted on the circuit board in the vicinity of the first Bias-T inductor with one electrode terminal connected to a second mounting land with an axial direction of the second Bias-T inductor inclined by 90° with respect to the axial direction of the first Bias-T inductor and the second Bias-T inductor is oriented perpendicular to the second mounting land and the one electrode terminal extends along the second mounting land.

An electrical component, a component arrangement and a method for producing a component arrangement are disclosed. In an embodiment an electrical component includes a coil form and a winding of a wire around the coil form and a connection area comprising a wire end of the wire, wherein the connection area is configured to latch with a mounting facility.

An adapter is provided and having a circuit board, primary components and secondary components installed on the circuit board, a shielding plate disposed between the primary components and the secondary components, and a transformer installed on the circuit board. The transformer has a bobbin, an iron core set assembled with the bobbin, at least one movable pin, at least one first winding, and at least one second winding. The movable pin is able to be positioned at an upper position for allowing the iron core set to be assembled with the bobbin or for allowing the first winding and the second winding to be wound onto the winding portion, and the movable pin is able to be positioned at a lower position when the transformer is installed onto the circuit board. Thereby, the adapter can be assembled in an automated process with improved assembly efficiency and high production yields.