The present disclosure provides a heat dissipation structure for a magnetic component and a magnetic component having the same. The magnetic component includes a plurality of heat dissipation pins, which are disposed on the winding of the magnetic component, wherein the magnetic component has one or more windings. The heat dissipation structure includes a circuit board on which a plurality of heat dissipation channels are disposed, and the heat dissipation pins of the windings are in contact with the heat dissipation channels; a plurality of heat conduction portions are disposed correspondingly under the heat dissipation channels of the circuit board; a heat conduction layer is arranged under the heat conduction portions and contacts with the heat conduction portions; and a heat dissipation layer is arranged under the heat conduction layer and contacts with the heat conduction layer.

A wireless power-supply system (1) performing a wireless power supply between a vehicle (10) and a stop station (20), wherein the wireless power-supply system includes a heat-transfer device (30). The heat-transfer device (30) transfers heat generated due to the wireless power supply to the stop station (20) having high heat capacity from the vehicle (10) having low heat capacity. The heat-transfer device (30) includes a flexible heat-transfer member (32), in which the flexible heat-transfer member has tiltability in a moving direction of the vehicle (10).

A wireless power-supply system (1) performing a wireless power supply between a vehicle (10) and a stop station (20), wherein the wireless power-supply system includes a heat-transfer device (30). The heat-transfer device (30) transfers heat generated due to the wireless power supply to the stop station (20) having high heat capacity from the vehicle (10) having low heat capacity. The heat-transfer device (30) includes a flexible heat-transfer member (32), in which the flexible heat-transfer member has tiltability in a moving direction of the vehicle (10).

A reactor cooling structure includes: a plurality of reactors that are stacked on one another, each reactor including a coil configured to produce magnetic flux when energized; and a cooling mechanism that cools the plurality of reactors, wherein each of the reactors has an exterior member that has: heat radiation surfaces respectively on both sides of the corresponding one of the reactors in a stacking direction of the stacked reactors i.e. a first direction, the heat radiation surfaces of the exterior member of each of the reactors being arranged to cool the coil of the corresponding one of the reactors; the cooling mechanism includes a cooling flow path for directly cooling the first and second heat radiation surfaces of the exterior member of each of the reactors by a refrigerant.

To reduce the size of a magnetic circuit to be provided in a pulse power module for applying a high voltage in the form of a pulse across a pair of discharge electrodes which are disposed in a laser chamber of a gas laser apparatus, the magnetic circuit may include a magnetic core, an insulation member configured to contain a refrigerant flow path therein and cover the periphery of the magnetic core, and a winding wound around the insulation member.

To reduce the size of a magnetic circuit to be provided in a pulse power module for applying a high voltage in the form of a pulse across a pair of discharge electrodes which are disposed in a laser chamber of a gas laser apparatus, the magnetic circuit may include a magnetic core, an insulation member configured to contain a refrigerant flow path therein and cover the periphery of the magnetic core, and a winding wound around the insulation member.

Systems and methods for liquid heat exchange for transformers are described. One embodiment of a fluid heat exchanger includes a transformer inlet port that is coupled to a transformer chamber and receives a dielectric fluid from the transformer chamber. Also included are a cooling fluid inlet for receiving a cooling fluid and a finned heat sink that includes a fluid communicator. The fluid communicator may receive, at a first chamber, the dielectric fluid from the transformer inlet port and directs the dielectric fluid across a first plurality of cooling fins. The fluid communicator may receive, at a second chamber, the cooling fluid from the cooling fluid inlet and may direct the cooling fluid across a second plurality of fins, where the fluid communicator separates the first chamber from the second chamber with a solid divider.

Systems and methods for liquid heat exchange for transformers are described. One embodiment of a fluid heat exchanger includes a transformer inlet port that is coupled to a transformer chamber and receives a dielectric fluid from the transformer chamber. Also included are a cooling fluid inlet for receiving a cooling fluid and a finned heat sink that includes a fluid communicator. The fluid communicator may receive, at a first chamber, the dielectric fluid from the transformer inlet port and directs the dielectric fluid across a first plurality of cooling fins. The fluid communicator may receive, at a second chamber, the cooling fluid from the cooling fluid inlet and may direct the cooling fluid across a second plurality of fins, where the fluid communicator separates the first chamber from the second chamber with a solid divider.

A method to construct a high current electronic device such as an inductor or a transformer with a single or multi-layer PCB with split traces and/or laminated bus bars and a high current electronic device built according to these methods. Traces are set-up with cross-overs to ensure the length of all traces is equal to maintain good current sharing. Then, PCBs or bus bars are stacked to provide the turns required for the inductor. Cooling plates are provided to cool the structure which is in turn encapsulated in a potting material.

A coil cooling structure comprises a coil which includes a strip-shaped conductor wound around a specific axis a plurality of times; an alumina layer which is formed on an end surface of the coil in the direction of the specific axis through thermal spraying of alumina and whose surface is flattened; a cooling plate which is mainly formed of alumina and has a flow passage for a cooling medium; and an adhesive which bonds the alumina layer and the cooling plate and which elastically deforms depending on a difference in thermal expansion between the alumina layer and the cooling plate.