Patent classifications
H01F6/04
Superconducting coil device and method for producing same
A superconducting coil device (10) includes: a coil case (20) housing a superconducting coil (30); a superconducting coil (30) housed in the coil case (20); and a resin part (50) formed of a polymer (51) filled in a gap between an inner wall of the coil case (20) and the superconducting coil (30). The resin part (50) is formed of a polymer (51) obtained by polymerizing a polymerizable composition containing a first monomer having a norbornene ring structure.
COLD STORAGE MATERIAL, REFRIGERATOR, DEVICE INCORPORATING SUPERCONDUCTING COIL, AND METHOD OF MANUFACTURING COLD STORAGE MATERIAL
A cold storage material, which has a large specific heat and a small magnetization in an extremely low temperature region and has satisfactory manufacturability, is provided, and a method for manufacturing the same is provided. Further, a refrigerator having high efficiency and excellent cooling performance is provided by filling this refrigerator with the above-described cold storage material. Moreover, a device incorporating a superconducting coil capable of reducing influence of magnetic noise derived from a cold storage material is provided. The cold storage material of embodiments is a granular body composed of an intermetallic compound in which the ThCr.sub.2Si.sub.2-type structure 11 occupies 80% by volume or more, and has a crystallite size of 70 nm or less.
SUPERCONDUCTING MAGNET
A superconducting magnet may include magnet coils including at least one group of outer coils and at least one group of inner coils, a container including an accommodating space, at least one first chamber that is disposed within the accommodating space and houses the at least one group of the inner coils, and at least one second chamber that is disposed within the accommodating space and houses the at least one group of the outer coils. The at least one first chamber and the at least one second chamber may be configured to be filled with a cooling medium and are in fluid communication with each other. The cooling medium may be configured to cool the magnet coils to a superconducting state.
SUPERCONDUCTING MAGNET
A superconducting magnet may include magnet coils including at least one group of outer coils and at least one group of inner coils, a container including an accommodating space, at least one first chamber that is disposed within the accommodating space and houses the at least one group of the inner coils, and at least one second chamber that is disposed within the accommodating space and houses the at least one group of the outer coils. The at least one first chamber and the at least one second chamber may be configured to be filled with a cooling medium and are in fluid communication with each other. The cooling medium may be configured to cool the magnet coils to a superconducting state.
Superconducting switch
The various embodiments described herein include methods, devices, and circuits for reducing switch transition time of superconductor switches. In some embodiments, an electrical circuit includes: (i) an input component configured to generate heat in response to an electrical input; and (ii) a first superconducting component thermally-coupled to the input component. The electrical circuit is configured such that, in the absence of the electrical input, at least a portion of the first superconducting component is maintained in a non-superconducting state in the absence of the electrical input; and, in response to the electrical input, the first superconducting component transitions to a superconducting state.
Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods
A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.
Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods
A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.
Self-supporting flexible thermal radiation shield
A self-supporting flexible shield for location between a warm surface and a cold mass so as to substantially enclose the cold mass, wherein the self-supporting flexible shield comprises a shaped plastic sheet with a low emissivity coating on both of its sides.
Self-supporting flexible thermal radiation shield
A self-supporting flexible shield for location between a warm surface and a cold mass so as to substantially enclose the cold mass, wherein the self-supporting flexible shield comprises a shaped plastic sheet with a low emissivity coating on both of its sides.
SUPERCONDUCTING COIL DEVICE AND ELECTRIC CURRENT INTRODUCTION LINE
A superconducting coil device includes a vacuum vessel, a superconducting coil located inside the vacuum vessel, a heat shield surrounding the superconducting coil within the vacuum vessel, and an electric current introduction line for introducing an electric current into the superconducting coil. The electric current introduction line includes an outer current lead part located outside of the heat shield, within the vacuum vessel, and thermally coupled to the heat shield, and an inner current lead part located inside of the heat shield and connecting the outer current lead part to the superconducting coil. The outer current lead part includes a main body serving as an electric current path to the superconducting coil, an insulation layer that covers the main body, and a heat shield layer that covers the insulation layer and has a lower emissivity than the insulation layer.