Provided are a filter element and a method of preparing a filter element. The filter element includes a pattern substrate having a first channel formed on one surface and a second channel formed on the other surface and including a first base and a second base which have different liquid permeabilities; a first liquid metal pattern disposed in the first channel; a second liquid metal pattern disposed in the second channel and at least partially overlapping the first liquid metal pattern; and a contactor configured to invade in the first base and the second base and electrically connect the first liquid metal pattern to the second liquid metal pattern.

A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency, the droplet can spread, allowing at least two conductors to be coupled.

A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency, the droplet can spread, allowing at least two conductors to be coupled.

A contact is provided that includes a first contact member formed of material containing tungsten, the first contact member having an exposed surface and a first pocket opening to the exposed surface, the first pocket having a circumscribing side wall and a bottom wall that define an interior of the first pocket; a first metal layer on the bottom wall of the first pocket and having a top surface that is below the exposed surface of the first contact member; a liquid metal layer formed of a material containing a Galinstan alloy on the top surface only of the first metal layer and extending above the exposed surface of the first contact member, and the liquid metal layer is compliant and is displaced by pressure applied to the liquid metal layer and returns to an original shape in response to removal of the pressure on the liquid metal layer.

A contact is provided that includes a first contact member formed of material containing tungsten, the first contact member having an exposed surface and a first pocket opening to the exposed surface, the first pocket having a circumscribing side wall and a bottom wall that define an interior of the first pocket; a first metal layer on the bottom wall of the first pocket and having a top surface that is below the exposed surface of the first contact member; a liquid metal layer formed of a material containing a Galinstan alloy on the top surface only of the first metal layer and extending above the exposed surface of the first contact member, and the liquid metal layer is compliant and is displaced by pressure applied to the liquid metal layer and returns to an original shape in response to removal of the pressure on the liquid metal layer.

A liquid level switch is provided having a first elongated substrate having one, two or three or more pairs of elongated electrical conductors thereon, a second elongated substrate having one two or three or more electrically conductive areas thereon, each electrically conductive area being positioned over an associated pair of electrical conductors positioned on the first elongated non-electrically conductive substrate for enabling electrical bridging contact between conductors of the pairs of electrical conductors, and a substrate coupler is provided for coupling the first and second non-electrically conductive substrates together for providing separation of the non-electrically conductive substrates in the absence of hydrostatic pressure thereon, and for causing contact between the first and second non-electrically conductive substrates in the presence of hydrostatic pressure thereon, producing the electrical bridging contact between pairs of conductors on the first non-electrically conductive substrate, in turn producing multiple level output signals.

An electrical contact is provided that includes a conductive base contact. The electrical contact may include a layer of a second material resistant to reaction with a liquid metal. The layer of second material may be bonded to the base contact. The electrical contact may include a layer of a third material. The third material may be a reaction product of a reactant metal with at least one metal of the liquid metal. The electrical contact may include a layer of the liquid metal that wets to a surface of the third material.

An electrical contact is provided that includes a conductive base contact. The electrical contact may include a layer of a second material resistant to reaction with a liquid metal. The layer of second material may be bonded to the base contact. The electrical contact may include a layer of a third material. The third material may be a reaction product of a reactant metal with at least one metal of the liquid metal. The electrical contact may include a layer of the liquid metal that wets to a surface of the third material.

An electrical contact is provided that includes a conductive base contact. The electrical contact may include a layer of a second material resistant to reaction with a liquid metal. The layer of second material may be bonded to the base contact. The electrical contact may include a layer of a third material. The third material may be a reaction product of a reactant metal with at least one metal of the liquid metal. The electrical contact may include a layer of the liquid metal that wets to a surface of the third material.

An electrical contact is provided that includes a conductive base contact. The electrical contact may include a layer of a second material resistant to reaction with a liquid metal. The layer of second material may be bonded to the base contact. The electrical contact may include a layer of a third material. The third material may be a reaction product of a reactant metal with at least one metal of the liquid metal. The electrical contact may include a layer of the liquid metal that wets to a surface of the third material.