An electronic device includes an input, an output, a metal fuse, a resistor, a heat control transistor, and a heat controller. The metal fuse is coupled between the input and the output. The resistor is coupled between the metal fuse and the heat control transistor. The heat control transistor is coupled between the resistor and a reference terminal of the electronic device, and the heat controller is configured to control a heater current of the heat control transistor.

An electronic device includes an input, an output, a metal fuse, a resistor, a heat control transistor, and a heat controller. The metal fuse is coupled between the input and the output. The resistor is coupled between the metal fuse and the heat control transistor. The heat control transistor is coupled between the resistor and a reference terminal of the electronic device, and the heat controller is configured to control a heater current of the heat control transistor.

A thermal cutoff at least includes a current-carrying fusible element having two ends connected to a first electrode and a second electrode. The current-carrying fusible element is provided in a closed cavity bounded by a housing having an opening at one end, a cover plate, and a sealant. The thermal cutoff further includes a first lead wire and a second lead wire each wrapped by an insulating sheath. One end of the first lead wire and one end of the second lead wire are electrically connected to the first electrode and the second electrode. The sealant is filled in the opening of the housing, covers an electrical joint between the first lead wire and a first electrode plate and an end of the first lead wire, and also covers an electrical joint between a second electrode plate and the second lead wire and an end of the second lead wire.

A thermal cutoff at least includes a current-carrying fusible element having two ends connected to a first electrode and a second electrode. The current-carrying fusible element is provided in a closed cavity bounded by a housing having an opening at one end, a cover plate, and a sealant. The thermal cutoff further includes a first lead wire and a second lead wire each wrapped by an insulating sheath. One end of the first lead wire and one end of the second lead wire are electrically connected to the first electrode and the second electrode. The sealant is filled in the opening of the housing, covers an electrical joint between the first lead wire and a first electrode plate and an end of the first lead wire, and also covers an electrical joint between a second electrode plate and the second lead wire and an end of the second lead wire.

The present disclosure provides a multifunctional fuse. The multifunctional fuse includes a fuse element, a pre-charging resistor, and an inner housing. The inner housing is provided with a receiving cavity, the fuse element is received in the receiving cavity, and the pre-charging resistor is wound around an outer side of the inner housing and is in contact with the inner housing. The multifunctional fuse of the present disclosure resolves problems of large volumes and high costs of a pre-charging resistor and a fuse in a high voltage circuit in the related art.

The present disclosure provides a multifunctional fuse. The multifunctional fuse includes a fuse element, a pre-charging resistor, and an inner housing. The inner housing is provided with a receiving cavity, the fuse element is received in the receiving cavity, and the pre-charging resistor is wound around an outer side of the inner housing and is in contact with the inner housing. The multifunctional fuse of the present disclosure resolves problems of large volumes and high costs of a pre-charging resistor and a fuse in a high voltage circuit in the related art.

A method comprises: forming a first metallization layer on a semiconductor die, the first metallization layer including a metal fuse; and forming a second metallization layer on the first metallization layer, in which the second metallization layer includes a thermal conductor spaced from the metal fuse, and the first metallization layer is between the second metallization layer and the semiconductor die.

A method comprises: forming a first metallization layer on a semiconductor die, the first metallization layer including a metal fuse; and forming a second metallization layer on the first metallization layer, in which the second metallization layer includes a thermal conductor spaced from the metal fuse, and the first metallization layer is between the second metallization layer and the semiconductor die.

A fuse resistor includes a substrate, an insulation layer, a fuse element, a protection layer, a first electrode, and a second electrode. The insulation layer covers a surface of the substrate. The fuse element is disposed on a portion of the insulation layer. The fuse element includes a first electrode portion, a melting portion, and a second electrode portion, in which the first electrode portion and the second electrode portion are respectively connected to two opposite ends of the melting portion. The protection layer covers the fuse element and the insulation layer, in which the protection layer has a cavity located on the melting portion. The first electrode is electrically connected to the first electrode portion. The second electrode is electrically connected to the second electrode portion.

A fuse resistor includes a substrate, an insulation layer, a fuse element, a protection layer, a first electrode, and a second electrode. The insulation layer covers a surface of the substrate. The fuse element is disposed on a portion of the insulation layer. The fuse element includes a first electrode portion, a melting portion, and a second electrode portion, in which the first electrode portion and the second electrode portion are respectively connected to two opposite ends of the melting portion. The protection layer covers the fuse element and the insulation layer, in which the protection layer has a cavity located on the melting portion. The first electrode is electrically connected to the first electrode portion. The second electrode is electrically connected to the second electrode portion.