A multi charged particle beam exposure method includes transmitting ON/OFF control signals each being an ON/OFF control signal for a corresponding beam of multi-beams of charged particle beams in a batch to a blanking apparatus in which there are mounted a substrate where a plurality of passage holes are formed to let a corresponding beam of the multi-beams individually pass therethrough, and a plurality of individual blanking mechanisms arranged in the substrate to individually perform blanking deflection of each beam of the multi-beams, and irradiating the substrate with the multi-beams in accordance with the ON/OFF control signals transmitted in a batch, while shifting an irradiation timing for each group obtained by grouping the multi-beams into a plurality of groups by a plurality of individual blanking mechanisms mounted in the blanking apparatus.

A multi-beam apparatus for multi-beam inspection with an improved source conversion unit providing more beamlets with high electric safety, mechanical availability and mechanical stabilization has been disclosed. The source-conversion unit comprises an image-forming element array having a plurality of image-forming elements, an aberration compensator array having a plurality of micro-compensators, and a pre-bending element array with a plurality of pre-bending micro-deflectors. In each of the arrays, adjacent elements are placed in different layers, and one element may comprise two or more sub-elements placed in different layers. The sub-elements of a micro-compensator may have different functions such as micro-lens and micro-stigmators.

Disclosed is a method of diagnosing a conversion process for converting a format of image data including unit data corresponding to charged particle beams into a format suitable for an aperture array, the aperture array having a plurality of controllers provided to match a plurality of the charged particle beams to control the charged particle beams, and a driver configured to drive the controllers. The method includes: extracting the unit data having an identical first rank based on an arrangement of the unit data in the image data from the unit data of each block including a predetermined number of the unit data and calculating a first checksum of each of the first rank; extracting the unit data having an identical second rank after the conversion process from the unit data of each block and calculating a second checksum of each of the second rank; and comparing the first and second checksums.

An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.

To provide a plasma processing apparatus or an operating method of a plasma processing apparatus with improved yield. The plasma processing apparatus includes: a sample stage disposed in the processing chamber in a vacuum container; a plasma forming space in which plasma for processing a wafer is formed above the sample stage and a lower space communicated with the plasma forming space below; an exhaust port disposed at a bottom portion of the lower space; a heater for heating a lower portion of the vacuum container surrounding the lower space; a first vacuum gauge that detects a pressure in the processing chamber during the processing of the wafer; a second vacuum gauge for calibration communicated with an opening disposed in an inner wall of the processing chamber surrounding an outer periphery of the lower space below the first vacuum gauge; and a correction unit that is configured to correct an output of the first vacuum gauge by using outputs of the first and second vacuum gauges when a pressure in the processing chamber is at a pressure value regarded as 0 and at a plurality of pressure values higher than the pressure value.

A multi charged particle beam blanking apparatus includes a substrate, where a plurality of passage holes are formed, to let multi-beams of charged particle beams individually pass through a passage hole concerned; a plurality of reference electrodes, each arranged close to a corresponding passage hole, to be applied with a reference potential, not a ground potential, not via a transistor circuit, in an irradiation region of the whole multi-beams; and a plurality of switching electrodes, arranged at the substrate such that each of the plurality of switching electrodes and a corresponding paired one of the plurality of reference electrodes are opposite each other across a corresponding passage hole, to be applied with the reference potential and a control potential different from the reference potential in a switchable manner.

The invention relates to an exposure apparatus and a method for projecting a charged particle beam onto a target. The exposure apparatus comprises a charged particle optical arrangement comprising a charged particle source for generating a charged particle beam and a charged particle blocking element and/or a current limiting element for blocking at least a part of a charged particle beam from a charged particle source. The charged particle blocking element and the current limiting element comprise a substantially flat substrate provided with an absorbing layer comprising Boron, Carbon or Beryllium. The substrate further preferably comprises one or more apertures for transmitting charged particles. The absorbing layer is arranged spaced apart from the at least one aperture.

A semiconductor-on-insulator (SOI) substrate includes a handle substrate, a charge-trapping layer located over the handle substrate and including nitrogen-doped polysilicon, an insulating layer located over the charge-trapping layer, and a semiconductor material layer located over the insulating layer. The nitrogen atoms in the charge-trapping layer suppress grain growth during anneal processes used to form the SOI substrate and during subsequent high temperature processes used to form semiconductor devices on the semiconductor material layer. Reduction in grain growth reduces distortion of the SOI substrate, and facilitates overlay of lithographic patterns during fabrication of the semiconductor devices. The charge-trapping layer suppresses formation of a parasitic surface conduction layer, and reduces capacitive coupling of the semiconductor devices with the handle substrate during high frequency operation such as operations in gigahertz range.

A semiconductor-on-insulator (SOI) substrate includes a handle substrate, a charge-trapping layer located over the handle substrate and including nitrogen-doped polysilicon, an insulating layer located over the charge-trapping layer, and a semiconductor material layer located over the insulating layer. The nitrogen atoms in the charge-trapping layer suppress grain growth during anneal processes used to form the SOI substrate and during subsequent high temperature processes used to form semiconductor devices on the semiconductor material layer. Reduction in grain growth reduces distortion of the SOI substrate, and facilitates overlay of lithographic patterns during fabrication of the semiconductor devices. The charge-trapping layer suppresses formation of a parasitic surface conduction layer, and reduces capacitive coupling of the semiconductor devices with the handle substrate during high frequency operation such as operations in gigahertz range.

In one embodiment, a multi-beam blanking device includes a semiconductor substrate, an insulating film that is disposed on the semiconductor substrate, an antistatic film that is disposed on the insulating film, a plurality of cells each of which is related to a through-hole that penetrate the semiconductor substrate and the insulating film and each of which includes a blanking electrode and a ground electrode that are disposed on the insulating film, and a ground wiring line that is disposed in the insulating film. The antistatic film and the ground wiring line are connected to each other at a joint that extends through the insulating film on the ground wiring line.