H01J25/34

TRAVELLING-WAVE TUBE
20220246381 · 2022-08-04 ·

A travelling-wave tube comprising a helix joined by posts to a vacuum chamber, each post made of electrically insulating material being covered by an electrically conductive material, of electrical conductivity comprised between 1000 and 100000 S.Math.m−1, over a portion of the post extending from the end of the post joined to the helix to the end of the post joined to the vacuum chamber and corresponding to a height comprised between 10% and 50% of the post.

TRAVELLING-WAVE TUBE
20220246381 · 2022-08-04 ·

A travelling-wave tube comprising a helix joined by posts to a vacuum chamber, each post made of electrically insulating material being covered by an electrically conductive material, of electrical conductivity comprised between 1000 and 100000 S.Math.m−1, over a portion of the post extending from the end of the post joined to the helix to the end of the post joined to the vacuum chamber and corresponding to a height comprised between 10% and 50% of the post.

Electron gun and manufacturing method therefor

An electron gun comprising a cathode having an electron emitting surface and whose planar shape is circular, a heater to increase the temperature of the cathode, and an anode to apply a positive electric potential relative to the cathode to extract electrons in a predetermined direction is provided. The cathode comprises a through hole at a central portion thereof along a central axis of the cathode, and either the cathode comprises a no-emitting layer at at least one of an opening edge on the electron emitting surface side of the through hole and an inner surface of the through hole, or the opening edge on the electron emitting surface side of the through hole is a chamfered C surface or a chamfered R surface.

Multi-layer vacuum electron device and method of manufacture
20220157549 · 2022-05-19 · ·

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Microwave amplification device including a microwave electron tube having a getter that can be controlled

The objective of the invention is to provide a microwave tube, or the like, wherein gas adsorption action of a getter may be satisfactorily performed independently from a microwave amplification operation. In order to solve this problem, this microwave electron tube comprises: a helix wherein a microwave may progress oriented from an input section to an output section within a helical tube; an electron gun emitting an electron flow oriented toward the helix; a focusing device causing the electron flow to traverse the vicinity of the helix in the direction of a collector; the collector absorbing the electron flow; and a getter having a heater insulated from the cathode provided in the electron gun.

Microwave amplification device including a microwave electron tube having a getter that can be controlled

The objective of the invention is to provide a microwave tube, or the like, wherein gas adsorption action of a getter may be satisfactorily performed independently from a microwave amplification operation. In order to solve this problem, this microwave electron tube comprises: a helix wherein a microwave may progress oriented from an input section to an output section within a helical tube; an electron gun emitting an electron flow oriented toward the helix; a focusing device causing the electron flow to traverse the vicinity of the helix in the direction of a collector; the collector absorbing the electron flow; and a getter having a heater insulated from the cathode provided in the electron gun.

SELF-ASSEMBLED HELICAL SLOW-WAVE STRUCTURES FOR HIGH-FREQUENCY SIGNALS

Traveling-wave tube amplifiers for high-frequency signals, including terahertz signals, and methods for making a slow-wave structure for the traveling-wave tube amplifiers are provided. The slow-wave structures include helical conductors that are self-assembled via the release and relaxation of strained films from a sacrificial growth substrate.

ARRANGEMENT OF CONDUCTION-COOLED TRAVELLING WAVE TUBES AND METHOD FOR MANUFACTURING AN ARRANGEMENT

An arrangement of conduction-cooled travelling wave tubes includes multiple travelling wave tubes mounted on a common base, wherein the travelling wave tubes are thermally connected to the base so that during operation of the travelling wave tubes the base forms a heat sink for the travelling wave tubes, and the base is designed to accommodate multiple travelling wave tubes in terms of their dimensions along their beam axes so as to increase the number of travelling wave tubes per surface area unit of the base.

ARRANGEMENT OF CONDUCTION-COOLED TRAVELLING WAVE TUBES AND METHOD FOR MANUFACTURING AN ARRANGEMENT

An arrangement of conduction-cooled travelling wave tubes includes multiple travelling wave tubes mounted on a common base, wherein the travelling wave tubes are thermally connected to the base so that during operation of the travelling wave tubes the base forms a heat sink for the travelling wave tubes, and the base is designed to accommodate multiple travelling wave tubes in terms of their dimensions along their beam axes so as to increase the number of travelling wave tubes per surface area unit of the base.

High-frequency module with connection interface

A high-frequency module can be used in communication satellites. The high-frequency module contains an electronic unit and a housing. The housing at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing. An internal connector is arranged on the housing, which is coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector. The internal connector is constructed integrally with at least a part of the housing. This allows a thermo-mechanical stress on the electronic unit to be reduced.