Disclosed is a field emission apparatus. The apparatus comprises a cathode electrode and an anode electrode spaced apart from each other, an emitter on the cathode electrode, a gate electrode between the cathode and anode electrodes and including at least one gate aperture overlapping the emitter, and an electron transmissive sheet on the gate electrode and including a plurality of fine openings overlapping the gate aperture.

An efficient source of EUV or SXR flux uses multiple e-beams from multiple cathodes to impact a wide anode target with a flux-generating surface to generate flux over a wide area. The conversion efficiency of e-beam power to flux power may be improved by the direction of the e-beams towards the anode target at shallow or grazing incidence angles or the use of mirrored anode surfaces which reflect EUV or SXR. The source is enclosed in a vacuum chamber and performs work such as the penetration of photoresist on a semiconductor wafer in vacuum.

This fluorescent display tube includes an anode and a plurality of filament-shaped cathodes both provided in an envelope, a support as one of a pair of support bodies which support the cathodes is electrically divided for each of the cathodes and at the time of driving, and a cathode driving IC gives pulse voltages to the cathodes at different timing. Since the voltages are applied to the arranged cathodes sequentially, current flowing through the cathode driving IC can be small as compared with a case where voltages are simultaneously applied to a plurality of cathodes. Heat generation of the cathode driving IC is suppressed, and costs required for the cathode driving IC are reduced.

This fluorescent display tube includes an anode and a plurality of filament-shaped cathodes both provided in an envelope, a support as one of a pair of support bodies which support the cathodes is electrically divided for each of the cathodes and at the time of driving, and a cathode driving IC gives pulse voltages to the cathodes at different timing. Since the voltages are applied to the arranged cathodes sequentially, current flowing through the cathode driving IC can be small as compared with a case where voltages are simultaneously applied to a plurality of cathodes. Heat generation of the cathode driving IC is suppressed, and costs required for the cathode driving IC are reduced.