Ion detectors of the type used in scientific instrumentation, such as mass spectrometers. More particularly, a self-contained particle detector includes an enclosure formed in part by a transmission mode secondary electron emissive element, the enclosure defining an internal environment and an external environment, wherein the transmission mode secondary electron emissive element has an externally facing surface and an internally facing surface and is configured such that impact of a particle on the externally facing surface causes emission of one or more secondary electrons from the internally facing surface.

Ion detectors of the type used in scientific instrumentation, such as mass spectrometers. More particularly, a self-contained particle detector includes an enclosure formed in part by a transmission mode secondary electron emissive element, the enclosure defining an internal environment and an external environment, wherein the transmission mode secondary electron emissive element has an externally facing surface and an internally facing surface and is configured such that impact of a particle on the externally facing surface causes emission of one or more secondary electrons from the internally facing surface.

A metasurface element includes a support body and a metasurface formed on a surface of the support body. The metasurface includes a metal pattern that is disposed to emit an electron in response to incidence of an electromagnetic wave, and a metal layer that contains an alkali metal and is formed on the metal pattern. The metal layer extends beyond the metal pattern to reach a region on the surface of the support body, the region being not formed with the metal pattern.

A metasurface element includes a support body and a metasurface formed on a surface of the support body. The metasurface includes a metal pattern that is disposed to emit an electron in response to incidence of an electromagnetic wave, and a metal layer that contains an alkali metal and is formed on the metal pattern. The metal layer extends beyond the metal pattern to reach a region on the surface of the support body, the region being not formed with the metal pattern.

A night vision system, a microchannel plate (MCP), and a planetary deposition system and methodology are provided for selectively depositing an electrode contact metal on one side of MCP channel openings. One or more MCPs can be releasably secured to a face of a platter that rotates about its central platter axis. The rotating platter can be tilted on a rotating ring fixture surrounding an evaporative source of contact metal. Therefore, the rotating platter further rotates so that it orbits around the evaporative source of contact metal. A mask with a variable size mask opening is arranged between the rotating platter and the evaporative source. While the mask orbits around the evaporative source with the rotating platter, the mask does not rotate along its own axis as does the rotating platter.

A night vision system, a microchannel plate (MCP), and a planetary deposition system and methodology are provided for selectively depositing an electrode contact metal on one side of MCP channel openings. One or more MCPs can be releasably secured to a face of a platter that rotates about its central platter axis. The rotating platter can be tilted on a rotating ring fixture surrounding an evaporative source of contact metal. Therefore, the rotating platter further rotates so that it orbits around the evaporative source of contact metal. A mask with a variable size mask opening is arranged between the rotating platter and the evaporative source. While the mask orbits around the evaporative source with the rotating platter, the mask does not rotate along its own axis as does the rotating platter.

An apparatus for amplifying an electron signal caused by the impact of a particle with an electron emissive surface. The apparatus includes: a first electron emissive surface configured to receive an input particle and thereby emit one or more secondary electrons, a series of second and subsequent electron emissive surfaces configured to form an amplified electron signal from the one or more secondary electrons emitted by the first electron emissive surface, and one or more power supplies configured to apply bias voltage(s) to one or more of the emissive surfaces. The bias voltage(s) is sufficient to form the amplified electron signal. The apparatus is configured such that the terminal electron emissive surface(s) of the series of second and subsequent electron emissive surfaces draw a higher electrical current than that of the remainder electron emissive surface(s). The apparatus may be used as part of detector in a mass spectrometer, for example.

A light intensifier includes a semiconductor structure to multiply electrons and block stray particles (e.g., photons and/or ions). The semiconductor structure includes an electron multiplier region that is doped to generate a plurality of electrons for each electron that impinges a reception surface of the semiconductor structure, blocking regions that are doped to direct the plurality of electrons towards emissions areas of an emission surface of the semiconductor structure, and shielding regions that are doped to absorb stray particles that impinge the emission surface of the semiconductor structure.

A light intensifier includes a semiconductor structure to multiply electrons and block stray particles (e.g., photons and/or ions). The semiconductor structure includes an electron multiplier region that is doped to generate a plurality of electrons for each electron that impinges a reception surface of the semiconductor structure, blocking regions that are doped to direct the plurality of electrons towards emissions areas of an emission surface of the semiconductor structure, and shielding regions that are doped to absorb stray particles that impinge the emission surface of the semiconductor structure.

A night vision system, a microchannel plate (MCP), and a planetary deposition system and methodology are provided for selectively depositing an electrode contact metal on one side of MCP channel openings. MCPs can be secured to a face of a platter that rotates about its central platter axis. The rotating platter can be tilted on a fixture surrounding an evaporative source of contact metal. A mask with a variable size mask opening is arranged between the rotating platter and the evaporative source. While the mask orbits around the evaporative source with the rotating platter, the mask does not rotate along its own axis as does the rotating platter. Depending on the opening of the non-rotating mask, and the tilt angle of the rotating platter, the respective circumferential distance around and the depth into the shaded first side of the channel opening is controlled.