Described herein is a kit of materials prepared for assays that involve determining relative abundance and/or absolute abundance of various targeted peptides. The kit may comprise trigger versions of target peptides with masses offset from the respective target peptides by predetermined and known amounts. The trigger peptides may be present in amounts that may be readily detected via a mass spectrometry analysis. When mixed with samples that are analyzed, detection of the trigger peptides indicates where in the mass-spectrometer output the target peptide may be found. The kit may include a predetermined amount of synthetic versions of one or more of the target peptides. A measured relative abundance of this synthetic peptide relative to that of the target peptides yields an absolute quantitative value of the target peptide. Also disclosed is a method of preparing a plurality of samples to be submitted for mass spectrometer analysis in parallel.

The present embodiment relates to an ion detector provided with a structure for suppressing degradation over time in an electron multiplication mechanism in the ion detector. The ion detector includes a dynode unit, serving as an electron multiplication mechanism, which multiplies secondary electrons which are emitted in response to incidence of ions, and a semiconductor detector having an electron multiplication function. Further, a focus electrode having an opening that allows passage of secondary electrons is disposed on a trajectory of secondary electrons which are directed from the dynode unit toward the semiconductor detector, and the focus electrode functions to guide secondary electrons from the dynode unit onto an electron incidence surface of the semiconductor detector.

The present embodiment relates to an ion detector provided with a structure for suppressing degradation over time in an electron multiplication mechanism in a multi-mode ion detector. The ion detector includes a dynode unit, a first electron detection portion including a semiconductor detector having an electron multiplication function, a second electron detection portion including an electrode, and a gate part. The first and second electron detection portions are capable of ion detection at different multiplication factors. The gate part includes at least a final-stage dynode as a gate electrode, and controls switching between passage and interruption of secondary electrons which are directed toward the first electron detection portion by adjusting a set potential of the gate electrode.

A process of fabricating a discrete-dynode electron multiplier (DDEM) including the steps of mounting an insulator block to a conductor block, and forming a series of ion-optics geometrical structures in the conductor block, each ion-optics geometrical structure having a smallest dimension of less than 1 millimeter. The forming step may be performed by electrical discharge machining (EDM), laser cutting, and/or water jet cutting.

A process of fabricating a discrete-dynode electron multiplier (DDEM) including the steps of mounting an insulator block to a conductor block, and forming a series of ion-optics geometrical structures in the conductor block, each ion-optics geometrical structure having a smallest dimension of less than 1 millimeter. The forming step may be performed by electrical discharge machining (EDM), laser cutting, and/or water jet cutting.

A process of fabricating a discrete-dynode electron multiplier (DDEM) including the steps of mounting an insulator block to a conductor block, and forming a series of ion-optics geometrical structures in the conductor block, each ion-optics geometrical structure having a smallest dimension of less than 1 millimeter. The forming step may be performed by electrical discharge machining (EDM), laser cutting, and/or water jet cutting.

A process of fabricating a discrete-dynode electron multiplier (DDEM) including the steps of mounting an insulator block to a conductor block, and forming a series of ion-optics geometrical structures in the conductor block, each ion-optics geometrical structure having a smallest dimension of less than 1 millimeter. The forming step may be performed by electrical discharge machining (EDM), laser cutting, and/or water jet cutting.

A process of fabricating a discrete-dynode electron multiplier (DDEM) including the steps of mounting an insulator block to a conductor block, and forming a series of ion-optics geometrical structures in the conductor block, each ion-optics geometrical structure having a smallest dimension of less than 1 millimeter. The forming step may be performed by electrical discharge machining (EDM), laser cutting, and/or water jet cutting.

A process of fabricating a discrete-dynode electron multiplier (DDEM) including the steps of mounting an insulator block to a conductor block, and forming a series of ion-optics geometrical structures in the conductor block, each ion-optics geometrical structure having a smallest dimension of less than 1 millimeter. The forming step may be performed by electrical discharge machining (EDM), laser cutting, and/or water jet cutting.