The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first semiconductor structure including a first substrate, and a first circuit layer positioned on the first substrate, a first redistribution structure positioned on the first circuit layer, and a second semiconductor structure including a second circuit layer positioned on the first redistribution structure, and a second substrate positioned on the second circuit layer. A layout of the first circuit layer and a layout of the second circuit layer are substantially the same and the first redistribution structure is electrically coupled to the first semiconductor structure and the second semiconductor structure.

A display device includes a substrate including a display area and a peripheral area surrounding the display area, a plurality of pads in a first direction of the peripheral area of the substrate and in a second direction perpendicular to the first direction, and a circuit film on the pads. Each of the pads includes a signal line on the substrate, a first dummy pattern on the substrate and spaced apart from the signal line in the first direction, and a first insulating pattern between the signal line and the first dummy pattern on the substrate.

An integrated circuit package may be fabricated with a universal dummy device, instead of utilizing a dummy device that matches the bump layer of an electronic substrate of the integrated circuit package. In one embodiment, the universal dummy device may comprise a device substrate having an attachment surface and a metallization layer on the attachment surface, wherein the metallization layer is utilized to form a connection with the electronic substrate of the integrated circuit package. In a specific embodiment, the metallization layer may be a single structure extending across the entire attachment surface. In another embodiment, the metallization layer may be patterned to enable gap control between the universal dummy device and the electronic substrate.

An integrated circuit package may be fabricated with a universal dummy device, instead of utilizing a dummy device that matches the bump layer of an electronic substrate of the integrated circuit package. In one embodiment, the universal dummy device may comprise a device substrate having an attachment surface and a metallization layer on the attachment surface, wherein the metallization layer is utilized to form a connection with the electronic substrate of the integrated circuit package. In a specific embodiment, the metallization layer may be a single structure extending across the entire attachment surface. In another embodiment, the metallization layer may be patterned to enable gap control between the universal dummy device and the electronic substrate.

A light-emitting diode structure for improving bonding yield is provided, which includes a light-emitting diode, a plurality of contact electrodes, an insulating layer structure, and a plurality of bonding electrodes. One surface of the light-emitting diode includes a mesa structure. The contact electrodes are on the mesa structure. The bonding electrodes are on the insulating layer structure and respectively cover at least one contact electrode. A surface of one of the bonding electrodes facing away from the light-emitting diode has a first platform and a second platform. The second platform is on the first platform. A surface area of a vertical projection of the second platform on the light-emitting diode is smaller than that of the first platform on the light-emitting diode, and said vertical projection of the second platform is within that of the first platform.

Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.

Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.

A module and a substrate are provided in the present disclosure. The module includes an array substrate and a flexible circuit board. The array substrate includes a binding region including a first binding region and a second binding region; and in the binding region, the flexible circuit board is bound with the array substrate. In the first binding region, the array substrate includes a first conductive soldering pad; the flexible circuit board includes a second conductive soldering pad; and the first conductive soldering pad is electrically connected to the second conductive soldering pad. In the second binding region, the array substrate includes one or more of first soldering elements; the flexible circuit board includes one or more of second soldering elements; a first soldering element of the one or more of first soldering elements is fixed with a second soldering element of the one or more of second soldering elements.

Provided are a stretchable electronic device and a method for manufacturing the same. The stretchable electronic device includes lines having lower pads, a chip provided on the lower pads and having first upper pads, which are wider than the lower pads, and an adhesive layer provided outside the lower pads or between the lower pads and bonded to the first upper pads.

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.