To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.

A method for bonding a semiconductor package includes loading a semiconductor chip on a substrate, and bonding the semiconductor chip to the substrate by using a bonding tool, the bonding tool including a pressing surface for pressing the semiconductor chip, and an inclined surface extending from one side of the pressing surface. Bonding the semiconductor chip to the substrate includes deforming a bonding agent disposed between the substrate and the semiconductor chip by pressing the bonding tool, and deforming the bonding agent includes generating a fillet by protruding a portion of the bonding agent beyond the semiconductor chip, and growing the fillet in such a way that a top surface of the fillet is grown in an extending direction of the inclined surface.

A sintering press to sinter electronic components on a substrate comprises a pressing unit comprising a multi-rod cylinder having a front head and a rear head which jointly delimit a compression chamber. In the front head, presser rods parallel and independent of each other are slidingly supported. Each presser rod is coaxial and barycentric to a respective electronic component to be sintered and has a thrust section proportional to the force to be applied to the respective electronic component. In the compression chamber a sealing membrane extends, which is deformed so as to abut against the presser rods for transferring the sintering pressure on each presser rod.

A bonding device (100) bonds at least one component (C) to a substrate (B) using a metal material (M). The bonding device (100) includes a wall section (20), at least one pressing section (40), and a rotational shaft (30). The rotational shaft (30) is fixed to the wall section (20). Each pressing section (40) has an arm (42) and a presser (43) or a substrate supporting member (90). The arm (42) extends from the rotational shaft (30). The arm (42) pivots about the rotational shaft (30). The presser (43) presses the component (C). The substrate supporting member (90) is disposed on a reference surface (142). The substrate supporting member (90) supports the substrate (B). The component (C) is bonded to the substrate (B) through point contact of the presser (43) with the component (C) or point contact of the substrate supporting member (90) with the reference surface (142).

To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.

A heating header of a semiconductor mounting apparatus includes: a first material; and a second material, the second material being bonded to the first material and coming into contact with a first semiconductor chip when the first semiconductor chip is compressed, wherein a contact surface of the second material with the first semiconductor chip is a curved surface that is convex toward the first semiconductor chip side, and the contact surface of the second material with the first semiconductor chip becomes a planar surface when each temperature of the first material and the second material reaches a melting temperature of a solder that is formed between a first terminal of the first semiconductor chip and a second terminal of a second semiconductor chip.

A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding head installed in the bonding head conveyor and moved and attaching a chip therebelow, wherein the bonding head is provided with a chip bonding unit for attaching the chip in a lower end portion thereof, wherein the chip bonding unit, includes: a chip bonding unit body having an installation groove formed therein; a pushing module having one end portion inserted in the installation groove; and an attachment module having a deformable member deformed by the pushing module; wherein the deformable member is provided with a deformable portion which is deformed by being pressed by the pushing module, and having a bottom surface in contact and exerting a force on the chip to bond the chip to the substrate.