H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/15
Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/15
Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/1531
the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
H01L2924/1531
the connection portion being formed only on the surface of the substrate opposite to the die mounting surface