A semiconductor device includes a semiconductor chip having a device forming surface on which a device structure is formed, a first conductive layer formed on the device forming surface of the semiconductor chip, a second conductive layer formed on the first conductive layer, a first wire that is connected to the second conductive layer and that is made of a material composed mainly of copper, and a third conductive layer that is formed between the first conductive layer and the second conductive layer and that includes a material harder than copper.

A semiconductor device includes a semiconductor chip having a device forming surface on which a device structure is formed, a first conductive layer formed on the device forming surface of the semiconductor chip, a second conductive layer formed on the first conductive layer, a first wire that is connected to the second conductive layer and that is made of a material composed mainly of copper, and a third conductive layer that is formed between the first conductive layer and the second conductive layer and that includes a material harder than copper.

An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

A semiconductor device includes first and second conductive parts, a first bonding wire connecting the first and second conductive parts and having a non-flat portion between opposite ends thereof so that a portion between the opposite ends is away from the first and second conductive parts, a case having a housing space to accommodate the first and second conductive parts, including a sidewall having first to fourth lateral faces surrounding the housing space to form a rectangular shape in a plan view, and a cover disposed on the sidewall, a sealing member filling the case to seal the first bonding wire, and a first stress relaxer for relieving a stress in the first bonding wire. The first bonding wire extends from the second lateral face toward the fourth lateral face, and the first stress relaxer is positioned between the first bonding wire and the first lateral face.

A semiconductor device includes first and second conductive parts, a first bonding wire connecting the first and second conductive parts and having a non-flat portion between opposite ends thereof so that a portion between the opposite ends is away from the first and second conductive parts, a case having a housing space to accommodate the first and second conductive parts, including a sidewall having first to fourth lateral faces surrounding the housing space to form a rectangular shape in a plan view, and a cover disposed on the sidewall, a sealing member filling the case to seal the first bonding wire, and a first stress relaxer for relieving a stress in the first bonding wire. The first bonding wire extends from the second lateral face toward the fourth lateral face, and the first stress relaxer is positioned between the first bonding wire and the first lateral face.

A method for manufacturing a light emitting device includes: preparing a first substrate having an upper surface comprising an element placement region; placing a light emitting element in the element placement region; disposing an uncured, sheet-like light-transmissive member on the light emitting element and bringing an outer edge of a lower surface of the light-transmissive member into contact with an outer upper surface of the element placement region of the first substrate by pressing the light-transmissive member; and disposing a first protrusion portion along an outer edge of an upper surface of the light-transmissive member so that the first protrusion portion extends over the upper surface of the first substrate and the upper surface of the light-transmissive member.

A method for manufacturing a light emitting device includes: preparing a first substrate having an upper surface comprising an element placement region; placing a light emitting element in the element placement region; disposing an uncured, sheet-like light-transmissive member on the light emitting element and bringing an outer edge of a lower surface of the light-transmissive member into contact with an outer upper surface of the element placement region of the first substrate by pressing the light-transmissive member; and disposing a first protrusion portion along an outer edge of an upper surface of the light-transmissive member so that the first protrusion portion extends over the upper surface of the first substrate and the upper surface of the light-transmissive member.

In some examples, a semiconductor package comprises a semiconductor die; a conductive member coupled to the semiconductor die; and a wirebonded protrusion coupled to the conductive member. A physical structure of the wirebonded protrusion is determined at least in part by a sequence of movements of a wirebonding capillary used to form the wirebonded protrusion, the wirebonded protrusion including a ball bond and a bond wire, and the bond wire having a proximal end coupled to the ball bond. The bond wire has a distal end. The package also comprises a mold compound covering the semiconductor die, the conductive member, and the wirebonded protrusion. The distal end is in a common vertical plane with the ball bond and is not connected to a structure other than the mold compound.

In some examples, a semiconductor package comprises a semiconductor die; a conductive member coupled to the semiconductor die; and a wirebonded protrusion coupled to the conductive member. A physical structure of the wirebonded protrusion is determined at least in part by a sequence of movements of a wirebonding capillary used to form the wirebonded protrusion, the wirebonded protrusion including a ball bond and a bond wire, and the bond wire having a proximal end coupled to the ball bond. The bond wire has a distal end. The package also comprises a mold compound covering the semiconductor die, the conductive member, and the wirebonded protrusion. The distal end is in a common vertical plane with the ball bond and is not connected to a structure other than the mold compound.