A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.

A chip package structure includes a substrate having a first surface and a second surface being opposite surfaces of the substrate; a housing disposed on the first surface of the substrate and enclosing a chip region; and a chip set disposed in the chip region and electrically connected to the substrate. The chip set includes a first chip and a second chip, and an active surface of the second chip faces the active surface of the first chip.

The display device comprises a first electrode and a second electrode disposed on a first surface of a substrate, the first electrode and the second electrode spaced apart from each other, least one light-emitting element disposed between the first electrode and the second electrode, a functional layer disposed on a second surface of the substrate, and a reflective layer disposed between the functional layer and the second surface of the substrate, the reflective layer overlapping the light-emitting element in a plan view.

A display module includes a substrate included a mounting surface on which a plurality of inorganic light emitting devices is mounted and a rear surface opposite the mounting surface, a metal plate facing the rear surface, and an adhesive layer provided between the rear surface of the substrate and the metal plate. An area of the substrate is equal to or greater than an area of the metal plate, the adhesive layer has an area corresponding to an area in which the metal plate faces the substrate, a coefficient of thermal expansion of the substrate is less than a coefficient of thermal expansion of the metal plate, and a ductility of the adhesive layer is greater than a ductility of the substrate and a ductility of the metal plate.

A wavelength conversion member includes: a phosphor; a metal joining layer provided on a bottom surface and a side surface of the phosphor; a metal heat-dissipating holding unit including a recess that covers the bottom surface and at least a portion of the side surface of the phosphor and that accommodates the phosphor so that the phosphor is embedded in the recess; and a metal porous joining material provided between the metal joining layer and the metal heat-dissipating holding unit.

A light emitting device includes a resin package including a first lead, a second lead, a resin portion holding the first lead and the second lead, at least one light emitting element mounted on the resin package, and a covering member covering at least a portion of an upper surface of each of the first lead, the second lead, and the resin portion. The resin portion includes at least one resin recess between the first lead and the second lead. At least a portion of the resin recess is located between a first portion of the first lead and a second portion of the second lead in a first direction, and is located between a first extended portion of the first lead and a second extended portion of the second lead in a second direction, and at least a portion of the resin recess is covered by the covering member.

A mother panel for a display panel includes: a mother substrate including a display panel area and a dummy area surrounding the display panel area, the mother substrate having a cutting line defined thereon, wherein the cutting line is configured to be irradiated by a laser along a boundary between the display panel area and the dummy area; and a first heat dissipation pattern on the mother substrate, extending from the display panel area to the dummy area to overlap the cutting line, and including a first rod portion including a plurality of lower rods spaced apart from each other and a first body portion in the dummy area and contacting the first rod portion.

Provided is a display apparatus including a transparent substrate, display modules on the transparent substrate, an interconnect, a cover layer and a control device. The display module includes a first circuit board, LED devices and a molding layer. The first circuit board has first and second surfaces opposite to each other, and is disposed on the transparent substrate with the first surface facing the transparent substrate. The LED devices are disposed on the first surface and electrically connected to the first circuit board. The molding layer is disposed on the first surface to cover the LED devices. The interconnect is disposed in the first circuit board and on the second surface to electrically connect the display modules to each other. The cover layer covers the display modules and the interconnect. The control device is electrically connected to a portion of the interconnect adjacent to the edge of the transparent substrate.

A display device includes a display panel including a first non-folding region, a folding region, and a second non-folding region sequentially arranged along a first direction, a first plate disposed under the display panel, a heat dissipation layer disposed under the first plate, and a first adhesive layer disposed between the first plate and the heat dissipation layer. The first adhesive layer includes a first sub adhesive layer overlapping the first non-folding region, and a second sub adhesive layer overlapping the second non-folding region, the first sub adhesive layer and the second sub adhesive layer are spaced apart from each other in the first direction, and a width of a first gap by which the first sub adhesive layer and the second sub adhesive layer are spaced apart is in a range of about 9 millimeters (mm) to about 12 mm.

A wiring substrate includes an insulating substrate including a first surface and a wiring conductor located at the insulating substrate, the insulating substrate containing multiple bulk crystallites of SiC with different polytypes. An electronic device includes the wiring substrate described above and an electronic component mounted on the wiring substrate. An electronic module includes the electronic device described above and a module substrate on which the electronic device is mounted.