Patent classifications
H01L41/332
Fabrication and Harvest of Piezoelectric Plates
A method is provided for fabricating piezoelectric plates. A sacrificial layer is formed overlying a growth substrate. A template layer, with openings exposing sacrificial layer surfaces, is formed over the sacrificial layer. An adhesion layer/first electrode stack is selectively deposited in the openings overlying the sacrificial layer surfaces, and a piezoelectric material formed in the openings overlying the stack. Then, a second electrode is formed overlying the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, attached to the sacrificial layer surfaces. After removing the template layer and annealing, the polygon-shaped structures are separated from the sacrificial layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.
High temperature flexural mode piezoelectric dynamic pressure sensor
A method for forming a pressure sensor includes forming a base of a sapphire material, the base including a cavity formed therein; forming a sapphire membrane on top of the base and over the cavity; forming a lower electrode on top of the membrane; forming a piezoelectric material layer on an upper surface of the lower electrode, the piezoelectric material layer being formed of aluminum nitride (AIN); and forming at least one upper electrode on an upper surface of the piezoelectric material layer.
Ultrasonic sensor and method for producing the same
Provided is an ultrasonic sensor including a piezoelectric elements arranged along a first direction and a second direction on a vibration plate, an insulation layer, and conductive lines. Each piezoelectric element including a first electrode, a piezoelectric layer, and a second electrode. The first electrode is partially removed in a regions between the piezoelectric elements. The second electrode is a separate electrode provided for each piezoelectric element. The insulation layer covers the second electrodes and has holes through which portions at opposite ends of the second electrodes along the first direction are partially exposed. Each conductive line is provided between adjacent ones of the second electrodes along the first direction and electrically connects, via the holes, the adjacent ones of the second electrodes.
METHOD FOR MANUFACTURING A PIEZOELECTRIC DEVICE
A method for manufacturing a piezoelectric device that includes a substrate, a piezoelectric layer directly or indirectly supported by the substrate and arranged above the substrate, a heater, and a heater electrode for driving the heater. Moreover, the method includes forming the piezoelectric layer, the heater, and the heater electrode and subjecting the piezoelectric device to heat treatment with heat generated from the heater by driving the heater by feeding electric power to the heater electrode.
Acoustic transducer with gap-controlling geometry and method of manufacturing an acoustic transducer
A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.
Ultrasound fingerprint sensing and sensor fabrication
Disclosed are systems, devices and methods for providing fingerprint sensors based on ultrasound imaging techniques in electronic devices and fabrication techniques for producing ultrasound-based fingerprint sensors. In some aspects, an ultrasound fingerprint sensor device includes an intermediate layer coupled to a base chip including an integrated circuit having conducive contacts at a surface of the base chip, the intermediate layer including an insulation layer formed on the base chip and a corresponding array of channeling electrode structures coupled to the conductive contacts and passing through the insulation layer, in which the channeling electrodes terminate at or above a top surface of the insulation layer to provide bottom electrodes; a plurality of ultrasonic transducer elements including an acoustic transducer material coupled to the bottom electrodes; and a plurality of top electrodes positioned on the ultrasonic transducer elements.
DUAL LAYER ULTRASONIC TRANSDUCER FABRICATION PROCESS
An array of piezoelectric micromachined ultrasonic transducers (PMUTs) includes a first piezoelectric layer and a second piezoelectric layer, a dielectric layer positioned between the first piezoelectric layer and the second piezoelectric layer, and a plurality of conductive layers positioned on opposing surfaces of the first piezoelectric layer and opposing surfaces of the second piezoelectric layer. A plurality of isolation trenches extend through the dielectric layer and at least a portion of conductive layers of the plurality of conductive layers, where the plurality of isolation trenches are positioned between neighboring PMUTs of the array of PMUTs such that the neighboring PMUTs are electrically isolated, and wherein the plurality of isolation trenches relieve stress in the dielectric layer.
MANUFACTURING METHOD AND OPTICAL DEFLECTOR
A manufacturing method for an optical deflector, in which a piezoelectric film layer having a uniform film thickness is formed on a substrate layer, includes forming a cavity to open to a SiO.sub.2 layer side in a forming region of an outside piezoelectric actuator by etching an SOI wafer from the SiO.sub.2 layer side, covering an exposed surface of the cavity with a SiO.sub.2 layer, and joining the SiO.sub.2 layer of the SOI wafer and a support layer of an SOI wafer to manufacture an SOI wafer in which the cavity is enclosed. Next, after a recess is formed on a back side of the SOI wafer, anisotropic dry etching is carried out from the back side in a depth direction of the recess to remove the SiO.sub.2 layer.
Site-Selective Piezoelectric-Layer Trimming
An apparatus is disclosed for site-selective piezoelectric-layer trimming. The apparatus includes at least one surface-acoustic-wave filter with an electrode structure and a piezoelectric layer. The electrode structure has multiple gaps. The piezoelectric layer has a planar surface defined by a first (X) axis and a second (Y) axis that is perpendicular to the first (X) axis. The piezoelectric layer is configured to propagate an acoustic wave along the first (X) axis. The piezoelectric layer includes a first portion that supports the electrode structure and a second portion that is exposed by the multiple gaps of the electrode structure. The second portion has different heights across the second (Y) axis. The different heights are defined with respect to a third (Z) axis that is substantially normal to the planar surface.
CRYSTAL VIBRATOR, METHOD FOR MANUFACTURING THE SAME, AND CRYSTAL VIBRATION DEVICE
A crystal vibrator that includes a crystal substrate having a front surface and a rear surface, including a vibration portion in a region including a center of the crystal substrate, and a first peripheral portion that surrounds a periphery of the vibration portion and that has a smaller thickness than the vibration portion. Drive electrodes are formed on both surfaces of the vibration portion of the crystal substrate. In at least one of the front surface and the rear surface of the crystal substrate, a step is provided between the vibration portion and the first peripheral portion, and a first peripheral edge portion of the vibration portion and a second peripheral edge portion of the first peripheral portion are in a curved surface shape.