A high-frequency component for guiding electromagnetic high-frequency waves includes a hollow conductor structure with a housing and a field-guiding region. The housing includes at least in part plastics material and the housing wall surface facing the field-guiding region includes a metal coating. Two or more parallel-guided cooling ducts can be integrated into the housing, the mutual spacing of which varies in accordance with a field density of an energy-guiding mode.

A high-frequency component for guiding electromagnetic high-frequency waves includes a hollow conductor structure with a housing and a field-guiding region. The housing includes at least in part plastics material and the housing wall surface facing the field-guiding region includes a metal coating. Two or more parallel-guided cooling ducts can be integrated into the housing, the mutual spacing of which varies in accordance with a field density of an energy-guiding mode.

The concepts, systems and methods described herein are directed towards a connectorless radio frequency (RF) interface between an antenna and RF processor. An RF interconnect is provided having a housing having a ridged waveguide portion provided therein, an upper cavity formed in an upper portion of the housing, a lower cavity formed in a lower portion of the housing, a first suspended air stripline (SAS) transmission line disposed in the lower cavity such that at least a portion of the first SAS transmission line crossed a slot formed by the ridged waveguide and a second SAS transmission line disposed in the upper cavity such that at least a portion of the second SAS transmission line crosses the slot formed by the ridged waveguide.