Provided are a transmitting device connected to a receiving device via a channel and the receiving device connected to the transmitting device via a channel. The transmitting device connected to a receiving device includes: a transmitter connected to the channel via an output node and configured to transmit, via the channel, a transmission signal to the receiving device, the transmitter having a transmission impedance associated therewith that is variable; and a monitoring device configured to detect a channel impedance of the channel and a receiving impedance of the receiving device by monitoring a voltage level of the output node, the monitoring device configured to set the transmission impedance based on the channel impedance and the receiving impedance.

The detection matrix for an Orthogonal Differential Vector Signaling code is typically embodied as a transistor circuit with multiple active signal inputs. An alternative detection matrix approach uses passive resistor networks to sum at least some of the input terms before active detection.

Provided are a transmitting device connected to a receiving device via a channel and the receiving device connected to the transmitting device via a channel. The transmitting device connected to a receiving device includes: a transmitter connected to the channel via an output node and configured to transmit, via the channel, a transmission signal to the receiving device, the transmitter having a transmission impedance associated therewith that is variable; and a monitoring device configured to detect a channel impedance of the channel and a receiving impedance of the receiving device by monitoring a voltage level of the output node, the monitoring device configured to set the transmission impedance based on the channel impedance and the receiving impedance.

Techniques and mechanisms for mitigating signal deterioration in communications between two circuit boards. In an embodiment, a packaged device accommodates coupling to a first circuit board which, in turn, accommodates connection to a second circuit board. In one such embodiment, an amplifier circuit of the packaged device includes an amplifier circuit which comprises a variable resistor and an active circuit element coupled thereto. The device receives via one of the circuit boards a control signal and a voltage which configure the amplifier circuit to provide an impedance matching for communication between the circuit boards. In another embodiment, the device comprises multiple common gate amplifiers which are variously configurable each to provide a respective impedance matching for communications between a motherboard and a dual in-line memory module.

Equalizing an input signal according to a receiver equalizer peaking circuit having a capacitor FET (CFET) providing a capacitive value and a resistor FET (RFET) providing a resistive value, generating a capacitor control voltage at a gate of the CFET using a capacitor controller DAC based on a first reference voltage, and a RFET control voltage at a gate of the RFET using a resistor controller DAC based on a second reference voltage, generating the first reference voltage using a replica input FET, the first reference voltage varying according to a threshold voltage (Vt) of an input FET, providing the first reference voltage to the capacitor controller DAC, generating the second reference voltage using a replica RFET, the second reference voltage varying with respect to the first reference voltage and a Vt of the replica of the RFET, and providing the second reference voltage to the resistor controller DAC.

A parallel resonant circuit with excellent distortion and saturation characteristics is provided at low power consumption. A first power-supply voltage is applied to the parallel resonant circuit. In the parallel resonant circuit, a variable resistor includes one or more parallel-connected branches. Each of the branches includes a series circuit of a resistor and a MOS switch. A second power supply supplies power of control signals applied to respective gates of the MOS switches, and supplies back gate voltages to the MOS switches. A power-supply voltage of the second power supply is higher than the first power-supply voltage.