The invention relates to a method for setting a dead time between the opening of a first switching element (31) of a half bridge (2) and the closing of a second switching element (32) of the half bridge (2), comprising the steps: reducing the dead time of a switching cycle relative to the dead time of a preceding switching cycle, and determining a temperature of at least one of the switching elements (31, 32); wherein the steps of reducing the dead time and of determining the temperature are repeated for subsequent switching cycles until a critical dead time is reached, in the case of which a termination condition, which depends on the determined temperature, is fulfilled; and wherein the dead time is set using the critical dead time.

An integrated circuit, including: a first current source; a second current source provided in parallel to the first current source; a first resistor with one end coupled to an output of the first current source; a first bipolar transistor that is diode-connected and is coupled to the other end of the first resistor; a second bipolar transistor that is diode-connected and is coupled to an output of the second current source; a second resistor coupled to the second bipolar transistor; and an output circuit configured to output a voltage based on a first voltage outputted from the first current source and a second voltage outputted from the second current source.

The present disclosure provides techniques for predicting failure of power switches and taking action based on the predictions. In an example, a method can include controlling the at least two parallel-connected power switches via a first driver and a second driver, the first a second driver responsive to a single command signal, measuring a failure characteristic of a first power switch, and disabling a first driver of the first power switch when the first failure characteristic exceeds a failure precursor threshold.

The present invention relates to a circuit for protecting a switch of an electrical system, said protecting circuit comprising a variable electronic component having a physical characteristic the value of which varies by at least 10% as a function of temperature, the protecting circuit being configured to prohibit a current from passing through said switch when the intensity of said current exceeds a maximum allowed intensity threshold, said variable electronic component being connected in the protecting circuit such that the value of the maximum allowed intensity threshold is directly a function of said physical characteristic.

An integrated circuit may include a power transistor coupled between a supply pin and an output pin; a current sensing circuit configured to sense a load current passing through the power transistor and to provide a respective current sense signal; a first configuration pin; a current output circuit configured to provide a diagnosis current at a current output pin; a diagnosis pin for receiving a diagnosis request signal; and a control circuit configured to: select a characteristic curve representing a current versus time characteristic dependent on a external circuit connected to the first configuration pin; generate a drive signal for the power transistor dependent on the selected characteristic curve and the current sense signal; and control—dependent on a pulse pattern of the diagnosis request signal—the current output circuit to set the value of the diagnosis current such that it represents the load current or the selected characteristic curve.

An integrated circuit includes a signal output circuit configured to output a timing signal indicating first and second timings of respectively switching first and second switching devices, first and second hold circuits respectively configured to receive first and second voltages corresponding to temperatures of the first and second switching devices, hold the first and second voltages for first and second time periods, and output the received first and second voltages in response to the first and second time periods having elapsed, and first and second control circuits respectively configured to control switching of the first and second switching devices with first and second driving capabilities corresponding to the temperatures of the first and second switching devices, based on the first and second voltages outputted from the first and second hold circuits and first and second driving signals for driving the first and second switching device.

Provided is a semiconductor device, including: a first electrode layer including a first wiring member and a second electrode layer including a second wiring member, the first electrode layer and the second electrode layer being disposed to face each other; a semiconductor element disposed in a gap between the first and second electrode layers, and electrically connected to the first and second electrode layers; and a via disposed in the gap between the first and second electrode layers, electrically connected to the first and second electrode layers, and configured to detect a state of the semiconductor element by being fractured at a predetermined temperature and losing electric connection.

A semiconductor device includes a first transistor that flows a current to a load, a current generation circuit that outputs a current corresponding to a power consumption of the first transistor, a temperature sensor, a resistor-capacitor network coupled between the current generation circuit and the temperature sensor and an overheat detection circuit coupled to a connection point of the current generation circuit and the resistor-capacitor network, wherein the resistor-capacitor network comprises a resistor and a capacitor corresponding to a thermal resistance and a thermal capacitance between the first transistor and the temperature sensor.

A solid-state multi-channel protection circuit includes a microcontroller, a current sensor, a plurality of temperature sensors, and first and second multiplexers selectively connecting the current sensor to one of a plurality of solid-state devices and each of the plurality of temperature sensors to the microcontroller. The microcontroller selectively controls the second multiplexer to receive a temperature output associated with one of the plurality of solid-state devices, and selectively controls the first multiplexer to receiver a current output related to the measured current associated with the same solid-state device, wherein the microcontroller provide over-current protection and over-temperature protection based on the received temperature output and the received current output.

A short circuit detection circuit includes a current terminal, a sense resistor, an amplifier, and a resistor-capacitor ladder. The sense resistor is coupled to the current terminal, and is configured to develop a sense voltage proportional to a current through the current terminal. The amplifier is coupled to the sense resistor, and is configured to generate a scaled current proportional to the sense voltage. The resistor-capacitor ladder is coupled to the amplifier, and is configured to generate a measurement voltage that represents a surface temperature rise due to the current through the current terminal.