The present disclosure relates to a solid-state image pickup device and an electronic apparatus by which a phase-difference detection pixel that avoids defects such as lowering of sensitivity to incident light and lowering of phase-difference detection accuracy can be realized. A solid-state image pickup device as a first aspect of the present disclosure is a solid-state image pickup device in which a normal pixel that generates a pixel signal of an image and a phase-difference detection pixel that generates a pixel signal used in calculation of a phase-difference signal for controlling an image-surface phase difference AF function are arranged in a mixed manner, in which, in the phase-difference detection pixel, a shared on-chip lens for condensing incident light to a photoelectric converter that generates a pixel signal used in calculation of the phase-difference signal is formed for every plurality of adjacent phase-difference detection pixels. The present disclosure is applicable to a backside illumination CMOS image sensor and an electronic apparatus equipped with the same.

The present disclosure relates to a solid-state image pickup device and an electronic apparatus by which a phase-difference detection pixel that avoids defects such as lowering of sensitivity to incident light and lowering of phase-difference detection accuracy can be realized. A solid-state image pickup device as a first aspect of the present disclosure is a solid-state image pickup device in which a normal pixel that generates a pixel signal of an image and a phase-difference detection pixel that generates a pixel signal used in calculation of a phase-difference signal for controlling an image-surface phase difference AF function are arranged in a mixed manner, in which, in the phase-difference detection pixel, a shared on-chip lens for condensing incident light to a photoelectric converter that generates a pixel signal used in calculation of the phase-difference signal is formed for every plurality of adjacent phase-difference detection pixels. The present disclosure is applicable to a backside illumination CMOS image sensor and an electronic apparatus equipped with the same.

There is provided an imaging element includes a photoelectric conversion unit that includes a first electrode, a photoelectric conversion layer, and a second electrode, in which the photoelectric conversion unit further includes a charge storage electrode that has an opposite region opposite to the first electrode via an insulating layer, and a transfer control electrode that is opposite to the first electrode and the charge storage electrode via the insulating layer, and the photoelectric conversion layer is disposed above at least the charge storage electrode via the insulating layer.

This application provides an image sensor (702) and image light sensing method. The image sensor (702) includes a red pixel (R), a green pixel (G), a blue pixel (B), and an invisible light pixel, where the red pixel (R), the green pixel (G), and the blue pixel (B) are large pixels, the invisible light pixel is a small pixel, and a light sensing area of the large pixel is greater than that of the small pixel. The red pixel (R), the green pixel (G), and the blue pixel (B) are arranged in a Bayer format. In this application, when color information is sufficient, light crosstalk caused by the small pixel to the large pixel can be reduced, and therefore a signal-to-noise ratio of the large pixel can be improved.

An image capturing device includes: an image capturing element having a first image capturing region that captures an image of a photographic subject and outputs a first signal, and a second image capturing region that captures an image of the photographic subject and outputs a second signal; a setting unit that sets an image capture condition for the first image capturing region to an image capture condition that is different from an image capture condition for the second image capturing region; a correction unit that performs correction upon the second signal, for employment in interpolation of the first signal; and a generation unit that generates an image of the photographic subject that has been captured by the first image capturing region by employing a signal generated by interpolating the first signal according to the second signal as corrected by the correction unit.

An image capturing device includes: an image capturing element having a first image capturing region that captures an image of a photographic subject and outputs a first signal, and a second image capturing region that captures an image of the photographic subject and outputs a second signal; a setting unit that sets an image capture condition for the first image capturing region to an image capture condition that is different from an image capture condition for the second image capturing region; a correction unit that performs correction upon the second signal, for employment in interpolation of the first signal; and a generation unit that generates an image of the photographic subject that has been captured by the first image capturing region by employing a signal generated by interpolating the first signal according to the second signal as corrected by the correction unit.

An image processing device according to one embodiment comprises a processing unit which receives first Bayer data from an image sensor, receives gyro data from a gyro sensor, and generates, from the first Bayer data, by using the received gyro data, second Bayer data compensated for camera movement.

A digital twin modeling method to assemble a robotic teleoperation environment, including: capturing images of the teleoperation environment; identifying a part being assembled; querying the assembly assembling order to obtain a list of assembled parts according to the part being assembled; generating a three-dimensional model of the current assembly from the list and calculating position pose information of the current assembly in an image acquisition device coordinate system; loading a three-dimensional model of the robot, determining a coordinate transformation relationship between a robot coordinate system and an image acquisition device coordinate system; determining position pose information of the robot in an image acquisition device coordinate system from the coordinate transformation relationship; determining a relative positional relationship between the current assembly and the robot from position pose information of the current assembly and the robot in an image acquisition device coordinate system; establishing a digital twin model of the teleoperation environment.

A digital twin modeling method to assemble a robotic teleoperation environment, including: capturing images of the teleoperation environment; identifying a part being assembled; querying the assembly assembling order to obtain a list of assembled parts according to the part being assembled; generating a three-dimensional model of the current assembly from the list and calculating position pose information of the current assembly in an image acquisition device coordinate system; loading a three-dimensional model of the robot, determining a coordinate transformation relationship between a robot coordinate system and an image acquisition device coordinate system; determining position pose information of the robot in an image acquisition device coordinate system from the coordinate transformation relationship; determining a relative positional relationship between the current assembly and the robot from position pose information of the current assembly and the robot in an image acquisition device coordinate system; establishing a digital twin model of the teleoperation environment.

The present technology relates to an image sensor and an electronic apparatus which enable higher-quality images to be obtained. Provided is an image sensor including a plurality of pixels, each pixel including one on-chip lens, and a plurality of photoelectric conversion layers formed below the on-chip lens. Each of at least two of the plurality of photoelectric conversion layers is split, partially formed, or partially shielded from light with respect to a light-receiving surface. The pixels are phase difference detection pixels for performing AF by phase difference detection or imaging pixels for generating an image. The present technology can be applied to a CMOS image sensor, for example.