Certain embodiments provide an imaging method for a non-line-of-sight object and an electronic device. In certain embodiments, the method includes: detecting a first input operation; and generating first image data in response to the first input operation. The first image data is imaging data of the non-line-of-sight object obtained by fusing second image data and third image data. The first image data includes position information between the non-line-of-sight object and a line-of-sight object. The second image data is imaging data of the line-of-sight object captured by the optical camera. The third image data is imaging data of the non-line-of-sight object captured by the electromagnetic sensor.

A semiconductor device is formed by providing a semiconductor die. A laser-assisted bonding (LAB) assembly is disposed over the semiconductor die. The LAB assembly includes an infrared (IR) camera. The IR camera is used to capture an image of the semiconductor die. Image processing is performed on the image to identify corners of the semiconductor die. Regions of interest (ROI) are identified in the image relative to the corners of the semiconductor die. Parameters can be used to control the size and location of the ROI relative to the respective corners. The ROI are monitored for temperature using the IR camera while LAB is performed.

A method for correcting thermal image distortion in a thermal camera in an apparatus for the layer-by-layer manufacture of three-dimensional objects, the thermal camera comprising a plurality of sensor pixels arranged along a first direction; the method comprising the steps of: (a) causing a temperature reference to be at a first steady state temperature; (b) moving the temperature reference at the first steady state temperature through a plurality of positions along the first direction through the field of view of the thermal camera; (c) recording a plurality of thermal images with the thermal camera while moving the temperature reference during step (b), each thermal image corresponding to one of the plurality of positions and comprising the detected temperature of the temperature reference as detected by at least one pixel of the plurality of sensor pixels; (d) identifying the at least one pixel that detected the temperature of the temperature reference within a respective thermal image at the corresponding one of the plurality of positions; (e) constructing a thermal map from the identified pixels representing the detected temperature of the temperature reference at the plurality of positions; (f) generating a correction matrix for the identified pixels based on comparison between the thermal map and the first steady state temperature; and (g) applying the correction matrix to subsequent measurements of the thermal camera. A controller and an apparatus for the layer-by-layer manufacture of three-dimensional objects comprising the controller to carry out the method are also provided.

A trigger sense circuit includes a pseudo-differential comparator circuit in signal communication with a pixel array. The pseudo-differential comparator circuit includes a first input in signal communication with a reference pixel group included in the pixel array to receive a pixel reference voltage, and a second input in signal communication with a target pixel group included in the pixel array to receive a pixel target voltage. The pseudo-differential comparator circuit is configured to selectively operate in a calibration mode to remove false trigger events and a comparison mode to detect at least one overheated pixel included in the target pixel group.

A mid-infrared upconversion imaging method and a mid-infrared upconversion imaging device are provided, which are used for imaging detection in a mid-infrared wavelength band, and related to a technical field of infrared imaging. The method includes directing pump laser and mid-infrared light into a chirped crystal component located in an optical cavity to obtain visible light; and imaging an object with the visible light.

To provide a power supply system, a power device, and a power method capable of wireless power supply with a simple configuration.

A power supply system includes a first infrared output unit provided on a first object, the first infrared output unit having a first directivity configured to output a first infrared ray in a first direction in which a second object that relatively moves with respect to the first object is situated, the first infrared output unit being configured to output the first infrared ray, a reflector provided on the second object, the reflector being configured to reflect the first infrared ray by retroreflection, a second infrared output unit provided on the second object, the second infrared output unit having a second directivity configured to output a second infrared ray in a second direction in which the first object that relatively moves is situated, the second infrared output unit being configured to output the second infrared ray by using power received by wireless power supply, and a power supply provided on the first object, the power supply being configured to, in a case of receiving a reflected infrared ray of the first infrared ray reflected by the reflector or in a case of receiving the second infrared ray, output a beam in an arrival direction of the reflected infrared ray or the second infrared ray.

An optical subsystem of a near-eye display system provides for projecting light of a virtual image of image content to an eye location, and provides for collecting light of the virtual image onto an exit pupil on a surface proximate to an outer surface of an eye when at the eye location. A subpupil modulator within an aperture in cooperation with the optical subsystem provides for forming a plurality of subpupils within the exit pupil, and provides for less than all of the light of the virtual image associated with one or more less than all of the plurality of subpupils to be projected to the eye location. In various independent aspects: at least two subpupils overlap by at least 20 percent; and the intensities of the subpupils are individually and independently controlled.

An image capturing device (100) includes an image capturing unit (110), an acquisition unit (131), an additional information imparting unit (132), and an output unit (133). The image capturing unit (110) extends straight in a longitudinal direction. The acquisition unit (131) acquires line data from the image capturing unit (110). The additional information imparting unit (132) imparts first additional information to the line data that is a head line of a frame out of a plurality of the line data to generate output line data. The output unit (133) outputs the output line data.

An image capturing device (100) includes an image capturing unit (110), an acquisition unit (131), an additional information imparting unit (132), and an output unit (133). The image capturing unit (110) extends straight in a longitudinal direction. The acquisition unit (131) acquires line data from the image capturing unit (110). The additional information imparting unit (132) imparts first additional information to the line data that is a head line of a frame out of a plurality of the line data to generate output line data. The output unit (133) outputs the output line data.

A road surface state detection apparatus includes a light emitter, an optical sensor, and an electronic control unit. The light emitter is configured to project an image with visible light on a road surface below a side of a vehicle. The optical sensor is provided on the side of the vehicle and configured to receive reflected light from the projected image. The electronic control unit is configured to determine a state of the road surface based on the reflected light received by the optical sensor.