An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.

A diaphragm assembly for a miniature acoustical transducer having a sufficiently light paddle to allow good audio performance and a sufficiently stiff frame to allow handling. The paddle may be made of a thin sheet of aluminium and the frame of thicker aluminium or a bent sheet of aluminium.

A MEMS microphone integrates a temperature-sensing element in or on the ASIC die of a MEMS microphone to enable an audio mode and a temperature-sensing mode in parallel. The system also permits for a method for easily switching between these two modes and for outputting both digital output signals at the same common output pad, which allows for the use of the footprint of a conventional microphone.

A moving robot may include a main body which forms a space therein, an inner housing which surrounds the main body, an outer housing, two voice recognition members/devices (or voice sensors) which are disposed in the housings and are disposed to be separated from each other, and a microphone mount which is supported by the inner housing and causes the voice recognition device to be in close contact with the outer housing. The microphone mount may include a bending prevention rib which is disposed below the microphone mount to prevent bending of the microphone mount, and a twist prevention rib which is disposed below the microphone mount to prevent twisting of the microphone mount.

A moving robot may include a main body which forms a space therein, an inner housing which surrounds the main body, an outer housing, two voice recognition members/devices (or voice sensors) which are disposed in the housings and are disposed to be separated from each other, and a microphone mount which is supported by the inner housing and causes the voice recognition device to be in close contact with the outer housing. The microphone mount may include a bending prevention rib which is disposed below the microphone mount to prevent bending of the microphone mount, and a twist prevention rib which is disposed below the microphone mount to prevent twisting of the microphone mount.

A MEMS microphone including a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip includes a bulk material with an aperture covered and closed by a mesh. The mesh includes a layer of the filter chip with parallel through-going first holes structured in the layer. The filter chip is arranged in or on the carrier board such that the mesh covers the sound opening.

Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.

The invention discloses a microphone structure with an improved substrate, comprising: a L-shaped substrate having an L-shaped normal cross section; an encapsulation shell, wherein the encapsulation shell and the L-shaped substrate form an acoustic cavity; the acoustic cavity is provided with: an acoustic transducer; an ASIC (Application Specific Integrated Circuit) chip, electrically connected to the acoustic transducer; and an acoustic through-hole disposed on the L-shaped substrate or the encapsulation shell. The present invention has the beneficial effects that, an L-shaped ceramic substrate is provided, a plurality of bonding pads are arranged on a vertical surface of the L-shaped substrate, so that electronic devices may be welded to the vertical surface of the L-shaped substrate, so that the problem of an excessive large area of the substrate being occupied by the electronic devices due to the presence of an excessive number of the electronic devices on the substrate may be avoided.

An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.

An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.