The present invention provides a coaxial speaker, which includes a frame, a vibration system and a magnetic circuit system. The magnetic circuit system includes a magnetic conduction assembly and a magnet assembly. The magnetic conduction assembly includes a first magnetic conduction plate, an inner side wall and an outer side wall, and a second magnetic conduction plate fixed on the side of the inner side wall. The magnet assembly includes a first magnet that forms a first magnetic gap and a second magnet that forms a second magnetic gap, a first vibration assembly and a second vibration assembly. The present invention is provided with high internal space integration, high magnetic circuit utilization, and meets the requirements of the full frequency domain.

A speaker includes a frame with a leakage hole, a magnetic circuit system and a vibration system received in the frame and a mesh covering the leakage hole. The vibration system comprises a diaphragm and a coil. The magnetic circuit system comprises a lower clamp and a magnet assembly stacked on the lower clamp. The mesh is integrally injection-molded with the frame, and comprises a central portion opposite to the leakage hole and a fixed portion located around the central portion and fixed with the frame. The fixed portion comprises an embedded portion embedded in the frame. The frame comprises a cover portion covering the embedded portion. The cover portion is provided with a recessed portion recessed from the surface of the cover portion away from the embedded portion toward the embedded portion until in contact with the embedded portion.

Provided is a speaker box, including a housing having a receiving space and a speaker unit received therein. The housing extends into the receiving space to form a support wall. The speaker unit is supported by and fixed to the support wall. The housing has a sound output hole. The speaker unit includes a frame, a vibration system and magnetic circuit unit fixed to the frame, and a front cover covering the frame. The front cover is supported by and fixed to the support wall. The front cover includes a main body portion located above the vibration system, a side edge portion and a fixed portion covering the frame. The fixed portion is supported by and fixed to the support wall. The front cover has a through hole running through both the main body portion and the side edge portion. The speaker box has excellent sound quality.

This application relate to the field of electronic device technologies, and in particular, to a loudspeaker and an electronic device. Embodiments of this application are provided to resolve a technical problem of insufficient sensitivity of a loudspeaker caused by a small electromagnetic driving force that drives a voice coil to vibrate. According to a loudspeaker and an electronic device in embodiments of this application, a yoke includes a bottom part and a sleeve located on the side of the bottom part. An annular magnet is sleeved on the outer side of the sleeve. A voice coil is sleeved on the sleeve and located between the magnet and the sleeve. A damper is located in a region enclosed by the sleeve. An outer edge of the damper is connected to the voice coil, and a middle part of the damper is connected to the yoke.

An electronic device includes a housing sidewall defining an opening and a display component, such as a display cover, disposed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is defined by the sidewall and the display cover with the cavity in fluid communication with an external environment through the gap. In at least one example, an epoxy component at least partially defines the cavity and can be in direct contact with the housing sidewall.

Provided are a sound absorbing material encapsulation structure for a sound production device, and a sound production device. The sound absorbing material encapsulation structure comprises: a rigid cavity wall enclosed to form a cavity of the sound absorbing material encapsulation structure, the cavity is configured to accommodate a sound absorbing material, the rigid cavity wall is provided with air permeability holes arranged in an array, the air permeability holes are configured to form a channel for air to flow in and out of the sound absorbing material encapsulation structure, diameters of air permeability holes are smaller than a diameter of sound absorbing material; a bottom plate sealed and connected to one end surface of rigid cavity wall, the bottom plate is configured to support the sound absorbing material; a covering plate provided to cover another end surface of rigid cavity wall and sealed and connected to the rigid cavity wall.

A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.

An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.

A speaker device is provided. The speaker device may include a circuit housing, an ear hook, a rear hook, and a speaker assembly. The circuit housing may be configured to accommodate a control circuit or a battery. The ear hook may be connected to one end of the circuit housing and at least a part of the ear hook being covered by a first housing sheath. The rear hook may be connected to the other end of the circuit housing and at least a part of the rear hook being covered by a second housing sheath. The first housing sheath and the second housing sheath may cover at least a part of a periphery of the circuit housing from two ends of the circuit housing, respectively. The speaker assembly may include an earphone core and a core housing for accommodating the earphone core.

The present disclosure provides a speaker, including a frame, a vibration system, a magnetic circuit system, the vibration system includes a first diaphragm and a second diaphragm which are fixed to two opposite sides of the frame, a first voice coil to drive the first diaphragm to vibrate, and a second voice coil assembly to drive the second diaphragm to vibrate. The vibration system further includes a first elastic wave assembly and a second elastic wave assembly which are fixed to the frame and are spaced from each other. The first elastic wave assembly and the second elastic wave assembly are in staggered distribution and antiphase vibration. By means of the staggered distribution of the first elastic wave assembly and the second elastic wave assembly, the first elastic wave assembly and the second elastic wave assembly make reasonable use of an internal space of the speaker.