The present invention relates to a filter and a method of manufacturing the same, the filter including an RF connector configured to have a predetermined electrical signal line, a filter body having at least one impedance matching space in which the RF connector is installed, a relevant PCB on which one end of the RF connector is fixedly mounted, the relevant PCB coupled to be in close contact with one side surface of the filter body, and an annular gasket interposed between one side surface of the filter body and the relevant PCB to block a signal leak, in which a concave-convex portion is processed on a surface of one side surface of the filter body to which the annular gasket is attached to increase an attachment area, thereby providing an advantage of improving a bonding force of an attachment portion to which the gasket is attached.

An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.

An electronic device may include a display module, a connecting member including a bending portion connected to a display panel of the display module and extending toward a rear surface of the display module, and a protective layer formed of an insulating material to cover the bending portion, a printed circuit board disposed on a rear surface of the display module and connected to the display module by the connecting member, a frame disposed to surround at least a portion of the display module and formed of a conductive material, a side member including a first partition wall portion disposed between the frame and the display module to be spaced apart from the frame and a second partition wall portion disposed to be spaced apart from the display module and coveting at least a portion of an outer periphery of the display module.

A connector for use with high-speed signals. The connector may include a row of conductive elements comprising signal conductors and ground conductors. A signal conductor may include a mating end, a mounting end opposite the mating end, and an intermediate portion extending therebetween. A ground conductor may include a shell at least partially encircling intermediate portions of a group of signal conductors, with openings that expose contact surfaces of the signal conductors at the ends. The ground conductors may include contact members aligned with the mating contact surfaces of the signal conductors. Each shell may be coupled to a ground mounting location on each side of a respective group of signal conductors, with adjacent shells sharing a ground mounting location. Such a configuration may meet signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.

A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.

A data storage device includes a memory module including a circuit board, a plurality of light emitting elements and a light guiding unit. The light emitting elements are electrically connected to the circuit board. The light guiding unit includes a light-homogenizing plate and a light output portion. The plate is disposed between the light output portion and the light emitting elements. A light diffusion space is disposed between the plate and the light output portion. The light emitted by the light emitting elements propagates sequentially into the plate, the light diffusion space, and the light output portion and then is output through the light output portion.

An apparatus for thermal interface material detection includes a heatsink stack up with a heatsink, a thermal interface material, a heat generating component, and a printed circuit board. The heatsink is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heatsink is configured for insertion of a compression probe, where a first end of the channel leads to a lower surface of the body of the heatsink and a second end of the channels leads to an upper surface of the body of the heatsink.

In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.

Lighting systems that include an LED and a silicone module designed to contain a lens are described herein.

A printed circuit board (PCB) system includes a first printed circuit board (PCB), an integrated circuit (IC) package, and a memory module. The IC package includes i) a package substrate, ii) a main IC chip that is electrically coupled to a top surface of the package substrate, iii) first contact structures that are disposed on a bottom surface of the package substrate and that are electrically coupled to the first PCB, and iv) second contact structures that are disposed on a top surface of the package substrate. The memory module includes i) a second PCB, ii) one or more memory IC chips that are disposed on the second PCB, and iii) third contact structures that are disposed on a bottom surface of the second PCB. An interposer electrically couples the second contact structures of the IC package with the third contact structures of the memory module.