Methods for securely transferring and attaching electrically conductive particles filled in openings to a binder resin layer. The methods include a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.

A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.

A display device includes: a display panel including a plurality of pad electrodes arranged in a first direction; a printed circuit board including a plurality of lead electrodes facing the plurality of pad electrodes, respectively; a plurality of conductive particles disposed between the display panel and the printed circuit board at predetermined intervals; and a coating layer disposed on the plurality of conductive particles and having a thickness varying in the first direction from each of the plurality of lead electrodes toward each of the plurality of pad electrodes.

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: a support plate having at least one electric element mounted on one surface thereof and including a plastic material having heat dissipation and insulation properties; and at least one bus bar electrically connected to the electric element and partially embedded in the support plate. Due to these features, since heat generated from the bus bar and the electric element is dissipated to the outside through the support plate, it is possible to prevent performance deterioration due to heat and breakage of electronic components.

A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.

An electro-optical device includes: a liquid crystal panel; a particle aligned type anisotropic conductive film having a plurality of electrically conductive particles that are arranged in a state of being aligned along a first direction and a second direction intersecting with the first direction; and a printed circuit board coupled to a connection terminal portion of the liquid crystal panel via the particle aligned type anisotropic conductive film, wherein the connection terminal portion includes a plurality of connection terminals, a plurality of recessed portions that are arranged in a state of being aligned along a third direction and a fourth direction intersecting with the third direction are formed on a surface of the connection terminal, and at least one of the first direction and the second direction along which the electrically conductive particles are arranged is different in arrangement direction from both the third direction and the fourth direction.

A photosensitive resin composition includes electrically conductive particles (A) whose surfaces are coated with a carbon simple substance and/or a carbon compound; an alkali-soluble resin (B) containing an acid-dissociation group; and a metal chelate compound (C) wherein the metal chelate compound (C) includes at least one selected from the group consisting of Au, Ag, Cu, Cr, Fe, Co, Ni, Bi, Pb, Zn, Pd, Pt, Al, Ti, Zr, W and Mo.

An object of the present disclosure is to provide a paste that can suppress fluctuations in viscosity at a printing temperature to perform printing without unevenness, and is sintered fast even in an inert gas atmosphere such as nitrogen to form a highly accurate conductive wiring and a joined structure excellent in joining strength. The present disclosure provides an adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect electronic elements, the adhesive conductive paste including a conductive particle and a solvent. The adhesive conductive paste contains, as the conductive particle, a silver particle (A) having an average particle size of 1 nm or greater and less than 100 nm and a silver particle (B) having an average particle size of 0.1 μm or greater and 10 μm or less, the silver particle (A) being a silver nanoparticle having a configuration in which a surface is coated with a protective agent containing amine, and the adhesive conductive paste contains, as the solvent, a compound (C) represented by Formula (I) below:

R.sup.a—O—(X—O).sub.n—R.sup.b  (I) where in Formula (I), R.sup.a represents a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, X represents a divalent group selected from a hydrocarbon group having from 2 to 6 carbon atoms, R.sup.b represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, R.sup.a and R.sup.b may be the same, n represents an integer from 1 to 3.

The invention provides a lighting device (1000) comprising (i) a light source (100) configured to generate light source light (101), wherein the light source (100) comprises a solid state light source, and (ii) a support (200) configured to support the light source (100), wherein the support (200) comprises a metal based thermally conductive material (201), wherein the lighting device (1000) further comprises (iii) a layered element (300), configured in physical contact with the support (200), wherein the layered element (300) comprises one or more layers (310), wherein the layered element (300) at least comprises an electrically insulating first layer (311), wherein at least part of the layered element (300) is configured between the light source (100) and the support (200) such that during operation part of the light source light (101) irradiates the layered element (300), wherein the layered element (300) comprises light reflective particles (410), wherein at least 50 wt. % of the particles have a flake-like shape.