Provided is a conductive particle which can effectively suppress occurrence of connection failure. A conductive particle (1, 11, 21) according to the present invention is a conductive particle including a base particle (2) and a conductive portion (3, 12, 22) disposed on a surface of the base particle, in which a particle diameter of the conductive particle is 30 μm or more, and a ratio of a resistance value (R20) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are repeated 20 times to a resistance value (R1) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are performed once is 1.5 or less.

A multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board.

An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers. Also an electronic device including the electrical conductor, and a method of preparing the electrical conductor.

Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

A laminate which includes a substrate 230, conductive fibers 221 and a resin layer, wherein, in said laminate, a ratio of increase in resistance after irradiation with light emitted from a xenon lamp at an intensity of 60 W/m.sup.2 (integrated value of spectral irradiance at a wavelength of 300 nm to 400 nm) for 300 hours is 20% or less.

A printed wiring board includes a main substrate, a standing substrate, a first electrode portion, and a second electrode portion. The second electrode portion is connected to the first electrode portion with solder while a support portion is inserted in a slit. The first electrode portion is provided to reach the slit. The second electrode portion is disposed to span from a bottom surface to a height position higher than or equal to a midpoint between a top surface and the bottom surface.

A manufacturing method for a multi-layer circuit board capable of being applied with electrical testing is provided. According to the multi-layer circuit board manufactured by the method, the multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not.

An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers. Also an electronic device including the electrical conductor, and a method of preparing the electrical conductor.

A multi-layer circuit board capable of being applied with electrical testing includes a metallic delivery loading plate, a bottom-layer circuit structure, a conductive corrosion-barrier layer, and a multi-layer circuit structure. The bottom-layer circuit structure is overlapping on the delivery loading plate. The conductive corrosion-barrier layer is disposed on the bottom dielectric layer. The multi-layer circuit structure is overlapping on the bottom-layer circuit structure. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the inner-layer circuit of the multi-layer circuit structure and the bottom-layer circuit of the bottom-layer circuit structure. The delivery loading plate and the bottom dielectric layer of the bottom-layer circuit structure expose the conductive corrosion-barrier layer.

According to one embodiment, a printed circuit board includes a first conductive layer on an insulating layer, including connection pads, a first mounting pad, a second mounting pad, a second wiring connecting the first mounting pad and one of the connection pads, and a first reinforcing pattern extending from the second mounting pad, a second conductive layer on another surface of the insulating layer, including a third wiring connected to one of the connection pads, and a conductive via connecting the second mounting pad and the third wiring. The second conductive layer includes a pad portion on the third wiring, opposed to the second mounting pad, and a third reinforcing pattern extending from the pad portion and opposed to the first reinforcing pattern.